BF999E6327HTSA1 Infineon Technologies MOSFET N-CH RF 20V 30MA SOT-23

label:
2024/03/21 241



CATALOG
BF999E6327HTSA1 Country of Origin
BF999E6327HTSA1 Lifecycle
BF999E6327HTSA1 oParametric Inf
BF999E6327HTSA1 Package Info
BF999E6327HTSA1 Manufacturing Info
BF999E6327HTSA1 Packaging Info


COUNTRY OF ORIGIN
China


LIFECYCLE
Obsolete
Jan 15,2024


PARAMETRIC INFO
Channel Type N
Configuration Single
Maximum Drain Source Voltage (V) 20
Maximum Continuous Drain Current (A) 0.03
Maximum Frequency (MHz) 300
Maximum Power Dissipation (mW) 200
Typical Output Capacitance @ Vds (pF) 0.9@10V
Typical Power Gain @ Vds (dB) 27@10V
Typical Forward Transconductance (S) 0.02
Typical Input Capacitance @ Vds (pF) 2.5@10V
Maximum Noise Figure (dB) 2.1(Typ)
Number of Elements per Chip 1
Types of Output Stages Single Ended
Typical Power Gain (dB) 27
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Maximum Gate Source Voltage (V) ±6.5
Material Si
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150


PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 3
Lead Shape Gull-wing
PCB 3
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 2.9
Package Width (mm) 1.3
Package Height (mm) 1(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 2.9
Package Overall Width (mm) 2.4
Package Overall Height (mm) 1
Seated Plane Height (mm) 1
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec TO-236AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 3000

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