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| CATALOG |
| BM10B-SRSS-TB COUNTRY OF ORIGIN |
BM10B-SRSS-TB PARAMETRIC INFO
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BM10B-SRSS-TB PACKAGE INFO
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BM10B-SRSS-TB MANUFACTURING INFO
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BM10B-SRSS-TB PACKAGING INFO
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| COUNTRY OF ORIGIN |
| Malaysia |
| Philippines |
| China |
| Thailand |
| Singapore |
| Taiwan (Province of China) |
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PARAMETRIC INFO
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| Supplier packaging |
SOIC N |
| Basic package type |
Lead-Frame SMT |
| Number of pins |
8 |
| Pin shape |
Gull-wing |
| PCB |
8 |
| ears |
N/R |
| Pin spacing (mm) |
1.27 |
| Package length (mm) |
4.9 |
| Package width (mm) |
3.9 |
| Package height (mm) |
1.25(Min) |
| Package diameter (mm) |
N/R |
| Mounting surface height (mm) |
1.75(Max) |
| Install |
Surface Mount |
| Package weight (g) |
not applicable |
| Packaging materials |
Plastic |
| package instruction |
Small Outline IC Narrow Body |
| Package series name |
SO |
| JEDEC |
MS-012AA |
| Package outline |
Link to datasheet |
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PACKAGE INFO
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| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
20 to 40 |
| Number of reflow cycles |
3 |
| standard |
J-STD-020C |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Plating materials |
not applicable |
| Number of Wave Cycles |
N/R |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
30 |
| Number of reflow cycles |
3 |
| standard |
IPC-1752 |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Wave soldering temperature source |
Link to datasheet |
| Lead Finish(Plating) |
Au |
| Plating materials |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
2 Years |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
|
| Package |
Tube |
| Packing quantity |
100 |
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