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• Complete, Fully Certified, Embedded 2.4 GHz
Bluetooth® Version 4.0 Module
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• Bluetooth Classic (BR/EDR) and Low Energy (LE)
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• Bluetooth SIG Certified
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• Onboard embedded Bluetooth Stack
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• Transparent UART mode for seamless serial data over
UART interface
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• Easy to configure with Windows GUI or direct by MCU
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• Firmware can be field upgradable via UART
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• Compact surface mount module: 22 x 12 x 2.4 mm
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| CATALOG |
BM77SPPS3MC2-0007AA PARAMETRIC INFO
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BM77SPPS3MC2-0007AA PACKAGE INFO
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BM77SPPS3MC2-0007AA MANUFACTURING INFO
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BM77SPPS3MC2-0007AA PACKAGING INFO
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BM77SPPS3MC2-0007AA ECAD MODELS
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PARAMETRIC INFO
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| Type |
Module |
| Power Class |
Class II |
| Minimum Operating Frequency (MHz) |
2402 |
| Maximum Operating Frequency (MHz) |
2480 |
| Maximum Data Rate (Mbps) |
3 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Minimum Operating Supply Voltage (V) |
3.2 |
| Maximum Operating Supply Voltage (V) |
4.3 |
| Typical Sensitivity (dBm) |
-92 |
| Maximum Supply Current (A) |
0.07 |
| Protocols Supported |
Bluetooth v4.0 (BLE) + EDR |
| Interface Type |
UART |
| Maximum Standby Current (A) |
2.543m(Typ) |
| Minimum Storage Temperature (°C) |
-40 |
| Maximum Storage Temperature (°C) |
85 |
| Antenna Mounting |
On Board |
| Processing Unit Type |
Microcontroller|Microprocessor |
| Special Features |
IoT |
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PACKAGE INFO
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| Supplier Package |
SMD Module |
| Pin Count |
33 |
| PCB |
33 |
| Tab |
N/R |
| Package Length (mm) |
22 |
| Package Width (mm) |
12 |
| Package Height (mm) |
2.4 |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Family Name |
SMD |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
2 |
| Maximum Reflow Temperature (°C) |
250 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
AuNi |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
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PACKAGING INFO
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| Packaging |
Tray |
| Quantity Of Packaging |
88 |
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ECAD MODELS
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