
|
|
• Charging
– 1% charge voltage accuracy
– 10% charge current accuracy
– Pin selectable USB 100-mA and 500-mA
maximum input current limit
– Programmable termination and precharge
threshold
|
• Protection
– 6.6-V overvoltage protection
– Input voltage dynamic power management
– 125°C thermal regulation; 150°C thermal
shutdown protection
– OUT short-circuit protection and ISET short
detection
– Operation over JEITA range via battery NTC
– ½ fast-charge-current at cold, 4.06 V at hot,
BQ092/3
– Fixed 10-hour safety timer
|
• System
– Automatic Termination and Timer Disable Mode
(TTDM) for absent battery pack with thermistor
– Status indication – charging/done
– Available in a small 10-pin MSOP package
|
|
CATALOG |
BQ24090DGQR COUNTRY OF ORIGIN |
BQ24090DGQR PARAMETRIC INFO
|
BQ24090DGQR PACKAGE INFO
|
BQ24090DGQR MANUFACTURING INFO
|
BQ24090DGQR PACKAGING INFO
|
BQ24090DGQR ECAD MODELS
|
BQ24090DGQR APPLICATIONS
|
|
COUNTRY OF ORIGIN |
Thailand |
China |
|
PARAMETRIC INFO
|
Type |
Linear Battery Charger |
Battery Type |
Li-Ion|Li-Pol |
Output Voltage (V) |
4.2 |
Minimum Operating Temperature (°C) |
0 |
Maximum Operating Temperature (°C) |
125 |
Minimum Operating Supply Voltage (V) |
3.5 |
Operating Supply Voltage (V) |
3.5 to 12 |
Maximum Operating Supply Voltage (V) |
12 |
Maximum Supply Current (mA) |
1000 |
Output Current (mA) |
1000(Max) |
Maximum Power Dissipation (mW) |
1920 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
Supplier Package |
HVSSOP EP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
10 |
Lead Shape |
Gull-wing |
PCB |
10 |
Tab |
N/R |
Pin Pitch (mm) |
0.5 |
Package Length (mm) |
3.1(Max) |
Package Width (mm) |
3.1(Max) |
Package Height (mm) |
0.95(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
3.1(Max) |
Package Overall Width (mm) |
5.05(Max) |
Package Overall Height (mm) |
1.1(Max) |
Seated Plane Height (mm) |
1.1(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Heat Sinked Very Thin Shrink Small Outline Package, Exposed Pad |
Package Family Name |
SO |
Jedec |
MO-187BA-T |
Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
PdNiAg |
Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2500 |
|
|
ECAD MODELS
|

|
|
APPLICATIONS
|
• Smart phones
|
• PDAs
|
• MP3 players
|
• Low-power handheld devices
|
|
|