BQ24092DGQR Texas Instruments IC BATT CHRGR LI-ION 10MSOP

label:

2023/11/15 305

• Charging
– 1% charge voltage accuracy
– 10% charge current accuracy
– Pin selectable USB 100-mA and 500-mA maximum input current limit
– Programmable termination and precharge threshold

• Protection
– 6.6-V overvoltage protection
– Input voltage dynamic power management
– 125°C thermal regulation; 150°C thermal shutdown protection
– OUT short-circuit protection and ISET short detection
– Operation over JEITA range via battery NTC
– ½ fast-charge-current at cold, 4.06 V at hot, BQ092/3
– Fixed 10-hour safety timer

• System
– Automatic Termination and Timer Disable Mode (TTDM) for absent battery pack with thermistor
– Status indication
– charging/done
– Available in a small 10-pin MSOP package

CATALOG

BQ24092DGQR COUNTRY OF ORIGIN

BQ24092DGQR PARAMETRIC INFO

BQ24092DGQR PACKAGE INFO

BQ24092DGQR MANUFACTURING INFO

BQ24092DGQR PACKAGING INFO

BQ24092DGQR ECAD MODELS

BQ24092DGQR FUNCTIONAL BLOCK DIAGRAM

BQ24092DGQR APPLICATIONS

COUNTRY OF ORIGIN

China

Malaysia

Thailand

PARAMETRIC INFO

Type	Linear Battery Charger
Battery Type	Li-Ion\|Li-Pol
Output Voltage (V)	4.2
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	150
Minimum Operating Supply Voltage (V)	3.5
Operating Supply Voltage (V)	3.5 to 12
Maximum Operating Supply Voltage (V)	12
Maximum Supply Current (mA)	1000
Output Current (mA)	1000(Max)
Maximum Power Dissipation (mW)	1920
Minimum Storage Temperature (°C)	-65
Maximum Storage Temperature (°C)	150

PACKAGE INFO

Supplier Package	HVSSOP EP
Basic Package Type	Lead-Frame SMT
Pin Count	10
Lead Shape	Gull-wing
PCB	10
Tab	N/R
Pin Pitch (mm)	0.5
Package Length (mm)	3.1(Max)
Package Width (mm)	3.1(Max)
Package Height (mm)	0.95(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	3.1(Max)
Package Overall Width (mm)	5.05(Max)
Package Overall Height (mm)	1.1(Max)
Seated Plane Height (mm)	1.1(Max)
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Heat Sinked Very Thin Shrink Small Outline Package, Exposed Pad
Package Family Name	SO
Jedec	MO-187BA-T
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	1
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020D
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Au
Under Plating Material	PdNiAg
Terminal Base Material	Cu Alloy

PACKAGING INFO

Packaging Suffix	R
Packaging	Tape and Reel
Quantity Of Packaging	2500

ECAD MODELS

Functional Block Diagram

APPLICATIONS

• Smart phones

• PDAs

• MP3 players

• Low-power handheld devices