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• USB 2.0 High Speed Switch
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• Detects USB Battery Charging Specification Version 1.2 (BCv1.2) Compliant Chargers
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• Compatible Accessories– Dedicated Charging Port– Standard Downstream Port– Charging Downstream Port
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| • Non-Standard Chargers– Apple™ Charger– TomTom™ Charger– USB Chargers Not Compliant With Battery Charging Specification Version 1.2 (BCv1.2)
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| • –2 V to 28 V VBUS Voltage Range |
| • ESD Performance Tested per JESD 22– 4000-V Human-Body Model– 1500-V Charged-Device Model (C101) |
| • ESD Performance DP_CON/DM_CON to GND– ±8-kV Contact Discharge (IEC 61000-4-2) |
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| CATALOG |
| BQ24392RSER COUNTRY OF ORIGIN |
BQ24392RSER PARAMETRIC INFO
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BQ24392RSER PACKAGE INFO
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BQ24392RSER MANUFACTURING INFO
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BQ24392RSER PACKAGING INFO
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BQ24392RSER EACD MODELS
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| BQ24392RSER APPLICATIONS |
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| COUNTRY OF ORIGIN |
| China |
| Thailand |
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PARAMETRIC INFO
|
| Maximum Operating Temperature (°C) |
85 |
| Maximum Operating Supply Voltage (V) |
5.25 |
| Minimum Operating Supply Voltage (V) |
4.75 |
| Typical Operating Supply Voltage (V) |
5 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-40 |
| Minimum Storage Temperature (°C) |
-65 |
| Protocols Supported |
USB 2.0 |
| Maximum Data Rate (Mbps) |
480 |
| Interface Type |
GPIO |
| USB Speed Type |
High Speed |
| type |
USB 2.0 High Speed Signal Conditioner |
| USB Transceiver |
no |
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PACKAGE INFO
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| Supplier packaging |
QUR |
| Basic package type |
Non-Lead-Frame SMT |
| Number of pins |
10 |
| Pin shape |
No Lead |
| PCB |
10 |
| ears |
N/R |
| Pin spacing (mm) |
0.5 |
| Package length (mm) |
2.05(Max) |
| Package width (mm) |
1.55(Max) |
| Package height (mm) |
0.55(Max) |
| Package diameter (mm) |
N/R |
| Mounting surface height (mm) |
0.6(Max) |
| Install |
Surface Mount |
| Package weight (g) |
not applicable |
| Packaging materials |
Plastic |
| package instruction |
Ultra Thin Quad Flat No Lead Package |
| Package series name |
QFN |
| JEDEC |
MO-288UEFD |
| Package outline |
Link to datasheet |
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|
MANUFACTURING INFO
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| MSL |
1 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
30 |
| Number of reflow cycles |
3 |
| standard |
J-STD-020D |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Lead Finish(Plating) |
Au |
| Plating materials |
ikB |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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|
PACKAGING INFO
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| Packaging Suffix |
R |
| Package |
Tape and reel packaging |
| Packing quantity |
3000 |
| Reel Diameter (in) |
7.09 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q1 |
| packaging type file |
Link to datasheet |
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|
ECAD MODELS
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APPLICATIONS
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• Mobile Phones
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| • Smart Phones |
| • Cameras |
| • GPS Systems |
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