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• Wireless Power Consortium (WPC) v1.2 Compliant (FOD Enabled) Highly Accurate Current Sense
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• Dynamic Rectifier Control for Improved Load Transient Response
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• Dynamic Efficiency Scaling for Optimized Performance Over Wide Range of Output Power
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• Adaptive Communication Limit for Robust Communication
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• Supports 20-V Maximum Input
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• Low-power Dissipative Rectifier Overvoltage Clamp (VRECT-OVP = 15 V)
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• Thermal Shutdown
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• Multifunction NTC and Control Pin for Temperature Monitoring, Charge Complete and Fault Host Control
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| CATALOG |
BQ51003YFPR COUNTRY OF ORIGIN
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BQ51003YFPR PARAMETRIC INFO
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BQ51003YFPR PACKAGE INFO
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BQ51003YFPR MANUFACTURING INFO
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BQ51003YFPR PACKAGING INFO
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BQ51003YFPR ECAD MODELS
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BQ51003YFPR APPLICATIONS
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COUNTRY OF ORIGIN
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China
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Philippines
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PARAMETRIC INFO
|
| Function |
Transmitter|Receiver |
| Wireless Power Standard |
Qi v1.2 |
| Maximum Output Power (W) |
2.5 |
| Maximum Input Voltage (V) |
20 |
| Output Voltage (V) |
5.01 |
| Maximum Output Current (A) |
0.75 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
DSBGA |
| Basic Package Type |
Ball Grid Array |
| Pin Count |
28 |
| Lead Shape |
Ball |
| PCB |
28 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.4 |
| Package Length (mm) |
3.04(Max) |
| Package Width (mm) |
1.91(Max) |
| Package Height (mm) |
0.31(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.5(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Die Size Ball Grid Array |
| Package Family Name |
BGA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
SnAgCu |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
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|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Packaging Document |
Link to Datasheet |
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| ECAD MODELS |
 |
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| APPLICATIONS |
| • WPC Compliant Receivers |
| • Cell Phones and Smart Phones |
| • Headsets |
| • Digital Cameras |
| • Portable Media Players |
| • Hand-held Devices |
| |
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