BQ78350DBTR-R1 Texas Instruments IC BATTERY MGMT CTRLR 30TSSOP

label:
2024/01/16 200



• Compensated end-of-discharge voltage (CEDV) gauging algorithm  
• Supports SMBus host communication
• Flexible configuration for 3- to 5-series (BQ76920), 6- to 10-series (BQ76930), and 9- to 15-series (BQ76940) li-ion and LiFePO4 batteries
• Supports battery configurations up to 320 Ahr  
• Supports charge and discharge current reporting up to 320 A
• On-chip temperature sensor option  
• External NTC thermistor support from companion AFE
• Full array of programmable protection features – Voltage, current, and temperature – System components  
• Lifetime data logging
• Supports CC-CV charging, including precharge, charge inhibit, and charge suspend  
• Offers an optional resistor programmable SMBus slave address for up to eight different bus addresses
• Drives up to a 5-segment LED or LCD display for state-of-charge indication
• Provides SHA-1 authentication


CATALOG
BQ78350DBTR-R1 COUNTRY OF ORIGIN
BQ78350DBTR-R1 PARAMETRIC INFO
BQ78350DBTR-R1 PACKAGE INFO
BQ78350DBTR-R1 MANUFACTURING INFO
BQ78350DBTR-R1 PACKAGING INFO
BQ78350DBTR-R1 ECAD MODELS
BQ78350DBTR-R1 FUNCTIONAL BLOCK DIAGRAM
BQ78350DBTR-R1 APPLICATIONS



COUNTRY OF ORIGIN
Malaysia



PARAMETRIC INFO
Type Fuel Gauge
Battery Type Li-Ion
Output Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Typical Operating Supply Voltage (V) 2.5
Minimum Operating Supply Voltage (V) 2.4
Operating Supply Voltage (V) 2.4 to 2.6
Maximum Operating Supply Voltage (V) 2.6
Maximum Supply Current (mA) 0.65(Typ)
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
 


PACKAGE INFO
Supplier Package TSSOP
Basic Package Type Lead-Frame SMT
Pin Count 30
Lead Shape Gull-wing
PCB 30
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 7.9(Max)
Package Width (mm) 4.5(Max)
Package Height (mm) 1.05(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 7.9(Max)
Package Overall Width (mm) 6.6(Max)
Package Overall Height (mm) 1.2(Max)
Seated Plane Height (mm) 1.2(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Thin Shrink Small Outline Package
Package Family Name SO
Package Outline Link to Datasheet
 


MANUFACTURING INFO
MSL 2
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
 


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 2000
Reel Diameter (in) 13
Reel Width (mm) 16.4
Tape Pitch (mm) 8
Tape Width (mm) 16
Component Orientation Q1
Packaging Document Link to Datasheet
 


ECAD MODELS



FUNCTIONAL BLOCK DIAGRAM



APPLICATIONS
• Light electric vehicles (levs): ebikes, escooters, pedelec, and pedal-assist bicycles
• Power and gardening tools
• Battery backup and uninterruptible power supply (UPS) systems
• Wireless base station backup systems
• Telecom power systems
• Handheld vacuum cleaners and robot vacuums

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