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• Item Summary 10uH±20%, 0.17A, 0603/1608 (EIA/JIS)
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• Lifecycle Stage Mass Production (Preferred)
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• Standard packaging quantity (minimum) Taping Embossed 3000pcs
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| CATALOG |
BRL1608T100M COUNTRY OF ORIGIN
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BRL1608T100M PARAMETRIC INFO
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BRL1608T100M PACKAGE INFO
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BRL1608T100M MANUFACTURING INFO
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BRL1608T100M PACKAGING INFO
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BRL1608T100M ECAD MODELS
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COUNTRY OF ORIGIN
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Philippines
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PARAMETRIC INFO
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| Type |
Power Chip |
| Technology |
Wirewound |
| Core Material |
Ferrite |
| Inductance (H) |
10u |
| Tolerance |
20% |
| Inductance Test Frequency (Hz) |
1M |
| Maximum DC Current (A) |
0.22 |
| Maximum Saturation Current (A) |
0.17 |
| Maximum DC Resistance (Ohm) |
2.6 |
| Minimum Self Resonant Frequency (Hz) |
45M |
| Maximum Operating Temperature (°C) |
105 |
| Minimum Operating Temperature (°C) |
-40 |
| Operating Temperature (°C) |
-40 to 105 |
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PACKAGE INFO
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| Case Size |
0603 |
| Maximum Product Length (mm) |
1.8 |
| Maximum Product Depth (mm) |
1 |
| Maximum Product Height (mm) |
0.7 |
| Maximum Product Diameter (mm) |
N/R |
| Number of Terminals |
2 |
| Product Weight (g) |
N/A |
| Terminal Pitch (mm) |
N/R |
| Mounting |
Surface Mount |
| Product Diameter (mm) |
N/R |
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MANUFACTURING INFO
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| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
5 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
N/A |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
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PACKAGING INFO
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| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
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ECAD MODELS
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