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• The SOT-223 Package can be soldered using wave or reflow. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die
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• Available in 12 mm Tape and Reel Use BSP52T1 to order the 7 inch/1000 unit reel Use BSP52T3 to order the 13 inch/4000 unit reel
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• PNP Complement is BSP62T1
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• Pb-Free Package is Available
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• S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements;AECQ101 Qualified and PPAP Capable
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CATALOG
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BSP52T1G COUNTRY OF ORIGIN
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BSP52T1G PARAMETRIC INFO
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BSP52T1G PACKAGE INFO
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BSP52T1G MANUFACTURING INFO
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BSP52T1G PACKAGING INFO
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COUNTRY OF ORIGIN
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Malaysia
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United States of America
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PARAMETRIC INFO
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| Type |
NPN |
| Configuration |
Single Dual Collector |
| Maximum Collector-Emitter Voltage (V) |
80 |
| Maximum Collector Base Voltage (V) |
90 |
| Maximum Emitter Base Voltage (V) |
5 |
| Maximum Continuous DC Collector Current (A) |
1 |
| Maximum Power Dissipation (mW) |
1250 |
| Maximum Base Emitter Saturation Voltage (V) |
1.9@0.5mA@500mA |
| Maximum Collector-Emitter Saturation Voltage (V) |
1.3@0.5mA@500mA |
| Minimum DC Current Gain |
1000@150mA@10V|2000@500mA@10V |
| Number of Elements per Chip |
1 |
| Minimum Operating Temperature (°C) |
-65 |
| Maximum Operating Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
SOT-223 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
4 |
| Lead Shape |
Gull-wing |
| PCB |
3 |
| Tab |
Tab |
| Pin Pitch (mm) |
2.3 |
| Package Length (mm) |
6.5 |
| Package Width (mm) |
3.5 |
| Package Height (mm) |
1.57 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
6.5 |
| Package Overall Width (mm) |
7 |
| Package Overall Height (mm) |
1.63 |
| Seated Plane Height (mm) |
1.63 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
TO-261AA |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging Suffix |
T1 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Packaging Document |
Link to Datasheet |
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