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| CATALOG |
BSP772TXUMA1 COUNTRY OF ORIGIN
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BSP772TXUMA1 PARAMETRIC INFO
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BSP772TXUMA1 PACKAGE INFO
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BSP772TXUMA1 MANUFACTURING INFO
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BSP772TXUMA1 PACKAGING INFO
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COUNTRY OF ORIGIN
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Malaysia
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PARAMETRIC INFO
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| Number of Outputs |
1 |
| Number of Inputs |
1 |
| Minimum Input Voltage (V) |
5 |
| Maximum Input Voltage (V) |
34 |
| Maximum Output Current (A) |
3.1(Typ) |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
150 |
| Switch On Resistance (mOhm) |
50 |
| Maximum Power Dissipation (mW) |
1500 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
DSO |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5 |
| Package Width (mm) |
4 |
| Package Height (mm) |
1.45 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5 |
| Package Overall Width (mm) |
6 |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Dual Small Outline |
| Package Family Name |
SO |
| Jedec |
N/A |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
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