BSZ130N03LSGATMA1 Infineon Technologies MOSFET N-CH 30V 35A TSDSON-8

label:
2024/04/18 228

CATALOG
BSZ130N03LSGATMA1 COUNTRY OF ORIGIN
BSZ130N03LSGATMA1 PARAMETRIC INFO
BSZ130N03LSGATMA1 PACKAGE INFO
BSZ130N03LSGATMA1 MANUFACTURING INFO
BSZ130N03LSGATMA1 PACKAGING INFO



COUNTRY OF ORIGIN
Malaysia



PARAMETRIC INFO
Channel Type N
Channel Mode Enhancement
Configuration Single Quad Drain Triple Source
Maximum Drain Source Voltage (V) 30
Maximum Continuous Drain Current (A) 10
Maximum Gate Source Voltage (V) ±20
Maximum Drain Source Resistance (mOhm) 13@10V
Typical Gate Charge @ Vgs (nC) 9.5@10V
Typical Gate Charge @ 10V (nC) 9.5
Operating Junction Temperature (°C) -55 to 150
Maximum Power Dissipation (mW) 2100
Process Technology OptiMOS
Minimum Gate Threshold Voltage (V) 1
Category Power MOSFET
Typical Output Capacitance (pF) 340
Typical Gate to Drain Charge (nC) 1.1
Typical Gate to Source Charge (nC) 2.7
Maximum Junction Ambient Thermal Resistance 60K/W
Typical Gate Resistance (Ohm) 1.1
Maximum Junction Case Thermal Resistance 5K/W
Maximum Positive Gate Source Voltage (V) 20
Minimum Gate Resistance (Ohm) 0.5
Maximum Gate Resistance (Ohm) 1.9
Typical Input Capacitance @ Vds (pF) 730@15V
Typical Reverse Transfer Capacitance @ Vds (pF) 15@15V
Typical Diode Forward Voltage (V) 0.89
Typical Switch Charge (nC) 2.6
Maximum Diode Forward Voltage (V) 1.1
Typical Forward Transconductance (S) 45
Maximum Pulsed Drain Current @ TC=25°C (A) 140
Typical Turn-On Delay Time (ns) 2.9
Typical Turn-Off Delay Time (ns) 13
Typical Fall Time (ns) 2.4
Typical Rise Time (ns) 2.6
Maximum Gate Source Leakage Current (nA) 100
Maximum Gate Threshold Voltage (V) 2.2
Maximum IDSS (uA) 1
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150
Tradename OptiMOS™



PACKAGE INFO
Supplier Package TSDSON EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 8
Lead Shape No Lead
PCB 8
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 3.3
Package Width (mm) 3.3
Package Height (mm) 1
Package Diameter (mm) N/R
Package Overall Length (mm) 3.3
Package Overall Width (mm) 3.3
Package Overall Height (mm) 1
Seated Plane Height (mm) 1
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description N/A
Package Family Name SON
Jedec N/A



MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material N/A
Number of Wave Cycles N/R



PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 5000
Reel Diameter (in) 13



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