Channel Type |
N |
Channel Mode |
Enhancement |
Configuration |
Single Quad Drain Triple Source |
Maximum Drain Source Voltage (V) |
30 |
Maximum Continuous Drain Current (A) |
10 |
Maximum Gate Source Voltage (V) |
±20 |
Maximum Drain Source Resistance (mOhm) |
13@10V |
Typical Gate Charge @ Vgs (nC) |
9.5@10V |
Typical Gate Charge @ 10V (nC) |
9.5 |
Operating Junction Temperature (°C) |
-55 to 150 |
Maximum Power Dissipation (mW) |
2100 |
Process Technology |
OptiMOS |
Minimum Gate Threshold Voltage (V) |
1 |
Category |
Power MOSFET |
Typical Output Capacitance (pF) |
340 |
Typical Gate to Drain Charge (nC) |
1.1 |
Typical Gate to Source Charge (nC) |
2.7 |
Maximum Junction Ambient Thermal Resistance |
60K/W |
Typical Gate Resistance (Ohm) |
1.1 |
Maximum Junction Case Thermal Resistance |
5K/W |
Maximum Positive Gate Source Voltage (V) |
20 |
Minimum Gate Resistance (Ohm) |
0.5 |
Maximum Gate Resistance (Ohm) |
1.9 |
Typical Input Capacitance @ Vds (pF) |
730@15V |
Typical Reverse Transfer Capacitance @ Vds (pF) |
15@15V |
Typical Diode Forward Voltage (V) |
0.89 |
Typical Switch Charge (nC) |
2.6 |
Maximum Diode Forward Voltage (V) |
1.1 |
Typical Forward Transconductance (S) |
45 |
Maximum Pulsed Drain Current @ TC=25°C (A) |
140 |
Typical Turn-On Delay Time (ns) |
2.9 |
Typical Turn-Off Delay Time (ns) |
13 |
Typical Fall Time (ns) |
2.4 |
Typical Rise Time (ns) |
2.6 |
Maximum Gate Source Leakage Current (nA) |
100 |
Maximum Gate Threshold Voltage (V) |
2.2 |
Maximum IDSS (uA) |
1 |
Number of Elements per Chip |
1 |
Minimum Storage Temperature (°C) |
-55 |
Maximum Storage Temperature (°C) |
150 |
Minimum Operating Temperature (°C) |
-55 |
Maximum Operating Temperature (°C) |
150 |
Tradename |
OptiMOS™ |