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| CATALOG |
BTS117TCBUMA1 COUNTRY OF ORIGIN
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BTS117TCBUMA1 PARAMETRIC INFO
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BTS117TCBUMA1 PACKAGE INFO
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BTS117TCBUMA1 MANUFACTURING INFO
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BTS117TCBUMA1 PACKAGING INFO
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COUNTRY OF ORIGIN
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Austria
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Malaysia
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PARAMETRIC INFO
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| Type |
Low Side |
| Number of Outputs |
1 |
| Number of Inputs |
1 |
| Interface Type |
On/Off |
| Maximum Output Current (A) |
3.5(Min) |
| Minimum Operating Temperature (°C) |
-40 |
| Output Type |
N-Channel |
| Maximum Operating Temperature (°C) |
150 |
| Switch On Resistance (mOhm) |
90 |
| Maximum Power Dissipation (mW) |
50000 |
| Process Technology |
SIPMOS |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
TO-263 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
3 |
| Lead Shape |
Gull-wing |
| PCB |
2 |
| Tab |
Tab |
| Package Length (mm) |
10 |
| Package Width (mm) |
9.25 |
| Package Height (mm) |
4.4 |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Double Deca Watt Package |
| Package Family Name |
TO-263 |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
245 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
NiP |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
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