BVSS123LT1G onsemi MOSFET N-CH 100V 170MA SOT-23-3

label:
2025/03/21 59
BVSS123LT1G onsemi 	MOSFET N-CH 100V 170MA SOT-23-3


• HBM Class 0A, MM Class M1B (Note 4)
• BVSS Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant


CATALOG
BVSS123LT1G COUNTRY OF ORIGIN
BVSS123LT1G PARAMETRIC INFO
BVSS123LT1G PACKAGE INFO
BVSS123LT1G MANUFACTURING INFO
BVSS123LT1G PACKAGING INFO
BVSS123LT1G ECAD MODELS


COUNTRY OF ORIGIN
China


PARAMETRIC INFO
Channel Type N
Channel Mode Enhancement
Configuration Single
Maximum Drain Source Voltage (V) 100
Maximum Continuous Drain Current (A) 0.17
Maximum Gate Source Voltage (V) ±20
Maximum Drain Source Resistance (mOhm) 6000@10V
Minimum Forward Transconductance (S) 0.08
ID For GFS (A) 0.1
VDS For GFS (V) 25
Operating Junction Temperature (°C) -55 to 150
Maximum Power Dissipation (mW) 225
Process Technology PowerTrench
Minimum Gate Threshold Voltage (V) 1.6
Category Power MOSFET
Typical Output Capacitance (pF) 9
Maximum Junction Ambient Thermal Resistance 556°C/W
Maximum Positive Gate Source Voltage (V) 20
Typical Input Capacitance @ Vds (pF) 20@25V
Typical Reverse Transfer Capacitance @ Vds (pF) 4@25V
Maximum Diode Forward Voltage (V) 1.3
Maximum Pulsed Drain Current @ TC=25°C (A) 0.68
Typical Turn-On Delay Time (ns) 20
Typical Turn-Off Delay Time (ns) 40
Maximum Gate Source Leakage Current (nA) 50
Maximum Gate Threshold Voltage (V) 2.6
Maximum IDSS (uA) 15
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150
Tradename PowerTrench®
Supplier Temperature Grade Automotive


PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 3
Lead Shape Gull-wing
PCB 3
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 2.9
Package Width (mm) 1.3
Package Height (mm) 0.94
Package Diameter (mm) N/R
Package Overall Length (mm) 2.9
Package Overall Width (mm) 2.4
Package Overall Height (mm) 1
Seated Plane Height (mm) 1
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec TO-236AB
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material FeNi Alloy


PACKAGING INFO
Packaging Suffix T1
Packaging Tape and Reel
Quantity Of Packaging 3000
Packaging Document Link to Datasheet


ECAD MODELS


Продукт RFQ