|
|
• Superior mechanical strength and high reliability due to the monolithic structure
|
• Outstanding frequency characteristics such as low ESR and low ESL by the simple structure
|
• Low self-heating value and high resistance to ripple on account of the low ESR
|
• No polarity
|
|
| CATALOG |
C3216X5R1H106K160AB COUNTRY OF ORIGIN
|
C3216X5R1H106K160AB PARAMETRIC INFO
|
C3216X5R1H106K160AB PACKAGE INFO
|
C3216X5R1H106K160AB MANUFACTURING INFO
|
C3216X5R1H106K160AB PACKAGING INFO
|
C3216X5R1H106K160AB APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Japan
|
|
PARAMETRIC INFO
|
| Capacitance Value |
10uF |
| Voltage |
50VDC |
| Tolerance |
10% |
| Dielectric |
X5R |
| Technology |
Standard |
| Maximum Operating Temperature (°C) |
85 |
| Case Style |
Ceramic Chip |
| Construction |
Flat |
| Microwave Application |
Yes |
| Operating Temperature (°C) |
-55 to 85 |
| Minimum Operating Temperature (°C) |
-55 |
| Equivalent Series Resistance Type |
Low |
| DC Rated Voltage (VDC) |
50 |
| Negative Capacitance Tolerance (%) |
-10 |
| Positive Capacitance Tolerance (%) |
10 |
| Maximum Dissipation Factor (%) |
7.5 |
| Polarity |
Non Polar |
| Special Features |
Low ESL |
| Fixed/Variable |
Fixed |
| Maximum Terminal Width (mm) |
1.8 |
|
|
PACKAGE INFO
|
| Package/Case |
1206 |
| Mounting |
Surface Mount |
| Termination Style |
Pad |
| Terminal Pitch (mm) |
N/R |
| Product Length (mm) |
3.2 |
| Product Depth (mm) |
1.6 |
| Product Height (mm) |
1.6 |
| Product Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
N/R |
| Product Weight (g) |
N/A |
| Length Tolerance (mm) |
±0.2 |
| Depth Tolerance (mm) |
±0.2 |
| Height Tolerance (mm) |
±0.2 |
| Diameter Tolerance (mm) |
N/R |
| Number of Terminals |
2 |
| Size (mm) |
3.2 X 1.6 X 1.6 |
| Maximum Product Length (mm) |
3.4 |
| Maximum Product Depth (mm) |
1.8 |
| Maximum Product Height (mm) |
1.8 |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
10 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
5 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ni |
| Terminal Base Material |
Cu |
| Number of Wave Cycles |
1 |
|
|
PACKAGING INFO
|
| Packaging Suffix |
A |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
9 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Plastic |
|
|
APPLICATIONS
|
• General electronic equipment
|
• Mobile devices
|
• Servers, PCs, tablets
|
• Power supply circuit
|
| |
One-stop supplier of IC products