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• Supports Standard, Fast and Fast−Plus I2C Protocol
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• 1.8 V to 5.5 V Supply Voltage Range
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• 128−Byte Page Write Buffer
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• Hardware Write Protection for Entire Memory
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• Schmitt Triggers and Noise Suppression Filters on I2C Bus Inputs(SCL and SDA)
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• Low Power CMOS Technology
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• 1,000,000 Program/Erase Cycles
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• 100 Year Data Retention
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• Industrial and Extended Temperature Range
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| CATALOG |
CAT24C512YI-GT3 COUNTRY OF ORIGIN
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CAT24C512YI-GT3 PARAMETRIC INFO
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CAT24C512YI-GT3 PACKAGE INFO
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CAT24C512YI-GT3 MANUFACTURING INFO
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CAT24C512YI-GT3 PACKAGING INFO
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CAT24C512YI-GT3 ECAD MODELS
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|
COUNTRY OF ORIGIN
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Thailand
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PARAMETRIC INFO
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| Density (bit) |
512K |
| Interface Type |
Serial-I2C |
| Maximum Operating Frequency (MHz) |
1 |
| Maximum Access Time (ns) |
400 |
| Typical Operating Supply Voltage (V) |
2.5|3.3|5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Maximum Cycle Time (s) |
5m |
| Programmability |
Yes |
| I/O Mode |
Serial |
| Density in Bits (bit) |
524288 |
| Maximum Operating Current (mA) |
2.5 |
| Hardware Data Protection |
Yes |
| Organization |
64Kx8 |
| Data Retention (Year) |
100(Min) |
| Minimum Operating Supply Voltage (V) |
1.8 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Storage Temperature (°C) |
-65 |
| Number of Bits per Word (bit) |
8 |
| Maximum Storage Temperature (°C) |
150 |
| Address Bus Width (bit) |
3 |
| Process Technology |
CMOS |
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PACKAGE INFO
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| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
3 |
| Package Width (mm) |
4.4 |
| Package Height (mm) |
0.9 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3 |
| Package Overall Width (mm) |
6.4 |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-153AA |
| Package Outline |
Link to Datasheet |
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|
MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
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|
PACKAGING INFO
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| Packaging Suffix |
T3 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Packaging Document |
Link to Datasheet |
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|
| ECAD MODEL |
 |
| |
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