CAT4139TD-GT3 onsemi IC LED DRIVER RGLTR DIM TSOT23-5

label:
2025/02/6 72
CAT4139TD-GT3 onsemi  IC LED DRIVER RGLTR DIM TSOT23-5


• Switch Current Limit 750 mA
• Drives LED Strings up to 22 V
• Up to 87% Efficiency
• Low Quiescent Ground Current 0.6 mA
• 1 MHz Fixed Frequency Low Noise Operation
• Soft Start “In−rush” Current Limiting
• Shutdown Current Less than 1 A


CATALOG
CAT4139TD-GT3 COUNTRY OF ORIGIN
CAT4139TD-GT3 LIFECYCLE
CAT4139TD-GT3 PARAMETRIC INFO
CAT4139TD-GT3 PACKAGE INFO
CAT4139TD-GT3 MANUFACTURING INFO
CAT4139TD-GT3 PACKAGING INFO
CAT4139TD-GT3 ECAD MODELS
CAT4139TD-GT3 APPLICATIONS


COUNTRY OF ORIGIN
Thailand
Malaysia


LIFECYCLE
Obsolete
Apr 06,2024


PARAMETRIC INFO
Number of Segments 27
Minimum Operating Supply Voltage (V) 2.8
Typical Operating Supply Voltage (V) 3.3|5
Maximum Operating Supply Voltage (V) 5.5
Output Voltage (V) 24(Max)
Interface Type PWM
Maximum Switching Frequency (MHz) 1.3
LED Pin I/O Support No
Maximum Quiescent Current (mA) 1.5
Hardware Reset Input No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Operating Supply Voltage (V) 2.8 to 5.5
Number of LED Outputs 1
Process Technology CMOS
Maximum Storage Temperature (°C) 160
Minimum Storage Temperature (°C) -65
Topology Boost
Maximum Output Current (mA) 100(Typ)
Input/Output Type DC/DC


PACKAGE INFO
Supplier Package TSOT-23
Basic Package Type Lead-Frame SMT
Pin Count 5
Lead Shape Gull-wing
PCB 5
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 2.9
Package Width (mm) 1.6
Package Height (mm) 0.87
Package Diameter (mm) N/R
Package Overall Length (mm) 2.9
Package Overall Width (mm) 2.8
Package Overall Height (mm) 1(Max)
Seated Plane Height (mm) 1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Thin Small Outline Transistor
Package Family Name SOT
Jedec MO-193
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix T3
Packaging Tape and Reel
Quantity Of Packaging 3000
Component Orientation Q3
Packaging Document Link to Datasheet

 
ECAD MODELS


APPLICATIONS
• GPS Navigation Systems
• Portable Media Players  
• Handheld Devices
Продукт RFQ