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• Automotive AEC−Q100 Grade 1 (−40°C to +125°C) Qualified
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• 10 MHz SPI Compatible
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• 2.5 V to 5.5 V Supply Voltage Range
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• SPI Modes (0,0) & (1,1)
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• 16−byte Page Write Buffer
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• Self−timed Write Cycle
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• Hardware and Software Protection
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• Block Write Protection
− Protect 1/4, 1/2 or Entire EEPROM Array
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• Low Power CMOS Technology
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• 1,000,000 Program/Erase Cycles
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• 100 Year Data Retention
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| CATALOG |
CAV25040VE-GT3 COUNTRY OF ORIGIN
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CAV25040VE-GT3 PARAMETRIC INFO
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CAV25040VE-GT3 PACKAGE INFO
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CAV25040VE-GT3 MANUFACTURING INFO
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CAV25040VE-GT3 PACKAGING INFO
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COUNTRY OF ORIGIN
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Philippines
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PARAMETRIC INFO
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| Density (bit) |
4K |
| Interface Type |
Serial-SPI |
| Maximum Operating Frequency (MHz) |
10 |
| Maximum Access Time (ns) |
35 |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Automotive |
| Programmability |
Yes |
| Density in Bits (bit) |
4096 |
| Maximum Operating Current (mA) |
2 |
| Hardware Data Protection |
Yes |
| Organization |
512x8 |
| Data Retention (Year) |
100(Min) |
| Minimum Operating Supply Voltage (V) |
2.5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
SOIC N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
5 to 6 |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/A |
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PACKAGING INFO
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| Packaging Suffix |
T3 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Packaging Document |
Link to Datasheet |
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