
|
|
| CATALOG |
| CC2640R2FRGZR COUNTRY OF ORIGIN |
CC2640R2FRGZR PARAMETRIC INFO
|
CC2640R2FRGZR PACKAGE INFO
|
CC2640R2FRGZR MANUFACTURING INFO
|
CC2640R2FRGZR PACKAGING INFO
|
CC2640R2FRGZR ECAD MODELS
|
CC2640R2FRGZR FUNCTIONAL BLOCK DIAGRAM
|
CC2640R2FRGZR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
| China |
Philippines
|
Thailand
|
|
PARAMETRIC INFO
|
| Type |
Module |
| Maximum Operating Frequency (MHz) |
2400(Typ) |
| Maximum Data Rate (Mbps) |
3 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Operating Supply Voltage (V) |
1.7|1.8 |
| Maximum Operating Supply Voltage (V) |
1.95|3.8 |
| Typical Sensitivity (dBm) |
-103 |
| Protocols Supported |
Bluetooth v4.2 (BLE)/Bluetooth v5.0 |
| Interface Type |
GPIO/I2C/SPI/UART |
| Solutions |
ISM |
| ISM Band |
1GHz |
| Minimum Storage Temperature (°C) |
-40 |
| Maximum Storage Temperature (°C) |
150 |
| Antenna Mounting |
External |
| Processing Unit Type |
Microcontroller |
|
|
PACKAGE INFO
|
| Supplier Package |
VQFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
48 |
| Lead Shape |
No Lead |
| PCB |
48 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
7.15(Max) |
| Package Width (mm) |
7.15(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
7.15(Max) |
| Package Overall Width (mm) |
7.15(Max) |
| Package Overall Height (mm) |
1(Max) |
| Seated Plane Height (mm) |
1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Thin Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
MO-220 |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au|AuAg |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|

|
|
FUNCTIONAL BLOCK DIAGRAM
|

|
|
| APPLICATION |
• Home and Building Automation
– Connected appliances
– Lighting
– Smart locks
– Gateways
– Security Systems
|
• Industrial
– Factory automation
– Asset tracking and management– HMI
– Access control
|
• Electronic Point Of Sale (EPOS)
– Electronic Shelf Label (ESL)
|
• Industrial control programmable logic controllers
|
| • Health and Medical
– Electronic thermometers
– SpO2
– Blood glucose monitors and blood pressure
monitors
– Weigh scales
– Hearing aids |
• Sports and Fitness
– Wearable fitness and activity monitors
– Smart trackers
– Patient monitors
– Fitness machines
|
• HID
– Gaming
– Pointing devices (wireless keyboard and
mouse)
|
| |