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■ Schmitt-trigger action on each input with no external components |
■ Hysteresis voltage typically 0.9 V at VDD=5 V and 2.3 V at VDD=10 V |
■ Noise immunity greater than 50% |
■ No limit on input rise and fall timreS |
■ Standardized, symmetrical output characteristics |
■ 100% tested for quiescent current at 20 V |
■ Maximum input current of 1 μA at 18 V over full package-temperature range, 100 nA at 18 V and 25°℃ |
■ 5-V, 10-V, and 15-V parametric ratings |
■ Meets all requirements of JEDEC for Description of 'B' Series CMOS Devices"
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CATALOG |
CD4093BE COUNTRY OF ORIGIN |
CD4093BE PARAMETRIC INFO |
CD4093BE PACKAGE INFO |
CD4093BE MANUFACTURING INFO |
CD4093BE PACKAGING INFO |
CD4093BE ECAD MODELS |
CD4093BE APPLICATIONS |
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COUNTRY OF ORIGIN |
China |
Thailand |
Malaysia |
Mexico |
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PARAMETRIC INFO |
Logic Family |
CD4000 |
Logic Function |
NAND |
Number of Element Inputs |
2-IN |
Number of Element Outputs |
1 |
Number of Elements per Chip |
4 |
Number of Output Enables per Element |
0 |
Number of Selection Inputs per Element |
0 |
Output Type |
Push-Pull |
Process Technology |
CMOS |
Input Type |
Schmitt Trigger |
Minimum Operating Supply Voltage (V) |
3 |
Maximum Operating Supply Voltage (V) |
18 |
Typical Operating Supply Voltage (V) |
3.3|5|9|12|15 |
Maximum High Level Output Current (mA) |
-4.2(Min) |
Maximum Low Level Output Current (mA) |
4.2(Min) |
Minimum Operating Temperature (°C) |
-55 |
Maximum Operating Temperature (°C) |
125 |
Maximum Propagation Delay Time @ Maximum CL (ns) |
380@5V|180@10V|130@15V |
Absolute Propagation Delay Time (ns) |
380 |
Propagation Delay Test Condition (pF) |
50 |
Maximum Quiescent Current (uA) |
20 |
Typical Quiescent Current (uA) |
0.04 |
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PACKAGE INFO |
Supplier Package |
PDIP |
Basic Package Type |
Through Hole |
Pin Count |
14 |
Lead Shape |
Through Hole |
PCB |
14 |
Tab |
N/R |
Pin Pitch (mm) |
2.54 |
Package Length (mm) |
19.69(Max) |
Package Width (mm) |
6.6(Max) |
Package Height (mm) |
5.08(Max) - 0.51(Min) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
19.69(Max) |
Package Overall Width (mm) |
10.92(Max) |
Package Overall Height (mm) |
5.08(Max) |
Seated Plane Height (mm) |
5.08(Max) |
Mounting |
Through Hole |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Plastic Dual In Line Package |
Package Family Name |
DIP |
Jedec |
MS-001AA |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO |
MSL |
N/R |
Maximum Reflow Temperature (°C) |
N/R |
Reflow Solder Time (Sec) |
N/R |
Number of Reflow Cycle |
N/R |
Maximum Wave Temperature (°C) |
N/A |
Wave Solder Time (Sec) |
N/A |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
Shelf Life Period |
5 Years |
Shelf Life Condition |
N/A |
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PACKAGING INFO |
Packaging |
Tube |
Quantity Of Packaging |
25 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS |
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APPLICATIONS |
■ Wave and pulse shapers |
■ High-noise-environment systems |
■ Monostable multivibrators |
■ Astable multivibrators |
■ NAND logic |
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