CD4093BE Texas Instruments IC GATE NAND 4CH 2-INP 14DIP

label:
2023/12/22 329


■ Schmitt-trigger action on each input with no external components
■ Hysteresis voltage typically 0.9 V at VDD=5 V and 2.3 V at VDD=10 V
■ Noise immunity greater than 50%   
■ No limit on input rise and fall timreS
■ Standardized, symmetrical output characteristics
■ 100% tested for quiescent current at 20 V
■ Maximum input current of 1 μA at 18 V over full package-temperature range, 100 nA at 18 V and 25°℃
■ 5-V, 10-V, and 15-V parametric ratings

■ Meets all requirements of JEDEC for Description of 'B' Series CMOS Devices"



CATALOG
CD4093BE COUNTRY OF ORIGIN
CD4093BE PARAMETRIC INFO  
CD4093BE PACKAGE INFO
CD4093BE MANUFACTURING INFO
CD4093BE PACKAGING INFO
CD4093BE ECAD MODELS
CD4093BE APPLICATIONS  


COUNTRY OF ORIGIN
China
Thailand
Malaysia
Mexico


PARAMETRIC INFO
Logic Family CD4000
Logic Function NAND
Number of Element Inputs 2-IN
Number of Element Outputs 1
Number of Elements per Chip 4
Number of Output Enables per Element 0
Number of Selection Inputs per Element 0
Output Type Push-Pull
Process Technology CMOS
Input Type Schmitt Trigger
Minimum Operating Supply Voltage (V) 3
Maximum Operating Supply Voltage (V) 18
Typical Operating Supply Voltage (V) 3.3|5|9|12|15
Maximum High Level Output Current (mA) -4.2(Min)
Maximum Low Level Output Current (mA) 4.2(Min)
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 125
Maximum Propagation Delay Time @ Maximum CL (ns) 380@5V|180@10V|130@15V
Absolute Propagation Delay Time (ns) 380
Propagation Delay Test Condition (pF) 50
Maximum Quiescent Current (uA) 20
Typical Quiescent Current (uA) 0.04
 
PACKAGE INFO
Supplier Package PDIP
Basic Package Type Through Hole
Pin Count 14
Lead Shape Through Hole
PCB 14
Tab N/R
Pin Pitch (mm) 2.54
Package Length (mm) 19.69(Max)
Package Width (mm) 6.6(Max)
Package Height (mm) 5.08(Max) - 0.51(Min)
Package Diameter (mm) N/R
Package Overall Length (mm) 19.69(Max)
Package Overall Width (mm) 10.92(Max)
Package Overall Height (mm) 5.08(Max)
Seated Plane Height (mm) 5.08(Max)
Mounting Through Hole
Package Weight (g) N/A
Package Material Plastic
Package Description Plastic Dual In Line Package
Package Family Name DIP
Jedec MS-001AA
Package Outline Link to Datasheet
 
MANUFACTURING INFO
MSL N/R
Maximum Reflow Temperature (°C) N/R
Reflow Solder Time (Sec) N/R
Number of Reflow Cycle N/R
Maximum Wave Temperature (°C) N/A
Wave Solder Time (Sec) N/A
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Shelf Life Period 5 Years
Shelf Life Condition N/A
 
PACKAGING INFO
Packaging Tube
Quantity Of Packaging 25
Packaging Document Link to Datasheet
 
ECAD MODELS


APPLICATIONS
■ Wave and pulse shapers
■ High-noise-environment systems
■ Monostable multivibrators
■ Astable multivibrators
■ NAND logic

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