CD74HC4052PWR Texas Instruments IC MUX/DEMUX DUAL 4X1 16TSSOP

label:
2025/12/1 0
CD74HC4052PWR Texas Instruments 	IC MUX/DEMUX DUAL 4X1 16TSSOP


• Qualified for automotive applications
• Wide analog input voltage range: ±5V maximum
• Low ON-resistance:– 70Ω typical (VCC – VEE = 4.5V)– 40Ω typical (VCC – VEE = 9V)
• Low crosstalk between switches
• Fast switching and propagation speeds
• Break-before-make switching
• Wide operating temperature range:–40°C to +125°C
• Operation control voltage: 4.5V to 5.5V
• Switch voltage: 0V to 10V


CATALOG
CD74HC4052PWR COUNTRY OF ORIGIN
CD74HC4052PWR PARAMETRIC INFO
CD74HC4052PWR PACKAGE INFO
CD74HC4052PWR MANUFACTURING INFO
CD74HC4052PWR PACKAGING INFO
CD74HC4052PWR ECAD MODELS
CD74HC4052PWR APPLICATIONS


COUNTRY OF ORIGIN
China
Taiwan (Province of China)
Malaysia


PARAMETRIC INFO
Type Analog Multiplexer
Number of Channels per Chip 2
Multiplexer Architecture 4:1
Maximum On Resistance Range (Ohm) 150 to 250
Configuration Dual 4:1
Maximum Off Leakage Current (nA) ±200
Number of Inputs per Chip 8
Function General
Maximum On Resistance Match Between Switches (Ohm) 10(Typ)
Latch-Up Proof No
Process Technology 130nm
Number of Outputs per Chip 2
Logic Family HC
Chip Enable Signals Yes
Maximum On Resistance (Ohm) 180@4.5V
Maximum Propagation Delay Bus to Bus (ns) 8@±4.5V|10@6V|12@4.5V|60@2V
Maximum Turn-On Time (ns) 325@2V
Maximum Turn-Off Time (ns) 250@2V
Input Signal Type Single
Output Signal Type Single
Propagation Delay Test Condition (pF) 50
Maximum Low Level Output Current (mA) 25
Maximum High Level Output Current (mA) 25
Maximum Frequency (25°C) @ Vcc (MHz) 185(Typ)@±4.5V|165(Typ)@±2.25V
Special Features Break-Before-Make
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 125
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65
Power Supply Type Single|Dual
Minimum Single Supply Voltage (V) 2
Typical Single Supply Voltage (V) 3|5
Maximum Single Supply Voltage (V) 6
Minimum Dual Supply Voltage (V) 0|2
Typical Dual Supply Voltage (V) ±3|±5
Maximum Dual Supply Voltage (V) ±6


PACKAGE INFO
Supplier Package TSSOP
Basic Package Type Lead-Frame SMT
Pin Count 16
Lead Shape Gull-wing
PCB 16
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 5
Package Width (mm) 4.4
Package Height (mm) 1.05(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5
Package Overall Width (mm) 6.4
Package Overall Height (mm) 1.2(Max)
Seated Plane Height (mm) 1.2(Max)
Mounting Surface Mount
Terminal Width (mm) 0.24
Package Weight (g) N/A
Package Material Plastic
Package Description Thin Shrink Small Outline Package
Package Family Name SO
Jedec MO-153
Package Outline Link to Datasheet
Maximum PACKAGE_DIMENSION_H 1.05
Minimum PACKAGE_DIMENSION_H N/A
Maximum PACKAGE_DIMENSION_L 5.1
Minimum PACKAGE_DIMENSION_L 4.9
Maximum PACKAGE_DIMENSION_W 4.5
Minimum PACKAGE_DIMENSION_W 4.3
Maximum Diameter N/R
Minimum Diameter N/R
Maximum Seated_Plane_Height 1.2
Minimum Seated_Plane_Height N/A
Ball Array Length (mm) N/R
Ball Array Width (mm) N/R
Stand-off Height (mm) 0.1
Number of Column Balls N/R
Number of Row Balls N/R
Terminal Length (mm) 0.63
Terminal Thickness (mm) 0.15
Bottom Pad Length (mm) N/R
Bottom Pad Width (mm) N/R
Bottom Pad Chamfer N/R


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn|Au
Under Plating Material N/A|Pd over Ni
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R
 
PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 2000
Reel Diameter (in) 13
Reel Width (mm) 12.4
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q1
Packaging Document Link to Datasheet
 
ECAD MODELS


APPLICATIONS
• Digital radio
• Signal gating
• Factory automation
• Televisions
• Appliances
• Programmable logic circuits
• Sensors
Продукт RFQ