|
|
• Overriding Reset Terminates Output Pulse
|
• Triggering From the Leading or Trailing Edge
|
• Q and Q Buffered Outputs
|
• Separate Resets
|
• Wide Range of Output-Pulse Widths
|
• Schmitt Trigger on Both A and B Inputs
|
• Fanout (Over Temperature Range)- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
|
• Wide Operating Temperature Range . . . -55oC to 125oC
|
• Balanced Propagation Delay and Transition Times
|
• Significant Power Reduction Compared to LSTTL Logic ICs
|
• HC Types- 2V to 6V Operation- High Noise Immunity: NIL = 30%, NIH = 30%of VCC at VCC = 5V
|
• HCT Types- 4.5V to 5.5V Operation- Direct LSTTL Input Logic Compatibility,VIL= 0.8V (Max), VIH = 2V (Min)- CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
|
|
| CATALOG |
CD74HC423M96 COUNTRY OF ORIGIN
|
CD74HC423M96 PARAMETER INFORMATION
|
CD74HC423M96 PACKAGING INFORMATION
|
CD74HC423M96 MANUFACTURING INFORMATION
|
CD74HC423M96 TYPE OF PACKAGING
|
CD74HC423M96 ECAD MODELS
|
|
COUNTRY OF ORIGIN
|
Mexico
|
|
PARAMETER INFORMATION
|
| Logic Family |
HC |
| Process Technology |
CMOS |
| Logic Function |
Monostable Multivibrator |
| Number of Elements per Chip |
2 |
| Minimum Operating Supply Voltage (V) |
2 |
| Maximum Operating Supply Voltage (V) |
6 |
| Typical Operating Supply Voltage (V) |
2.5|3.3|5 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
125 |
| Vendor Temperature Grade |
Military |
| Maximum High Level Output Current (mA) |
-5.2 |
| Maximum Low Level Output Current (mA) |
5.2 |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
320@2V|64@4.5V|54@6V |
| Maximum Quiescent Current (mA) |
0.008 |
| Absolute Propagation Delay Time (ns) |
480 |
|
|
PACKAGING INFORMATION
|
| Supplier Packaging |
SOIC |
| Basic package types |
Lead-Frame SMT |
| Number of Pins |
16 |
| Pin shape |
Gull-wing |
| PCB |
16 |
| Ear piece |
N/R |
| Pin spacing (mm) |
1.27 |
| Package length (mm) |
10(Max) |
| Package width (mm) |
4(Max) |
| Package height (mm) |
1.5(Max) |
| Package diameter (mm) |
N/R |
| Package Overall Length (mm) |
10(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Mounting surface height (mm) |
1.75(Max) |
| Install |
Surface Mount |
| Package weight (g) |
not applicable |
| Packaging materials |
Plastic |
| package instruction |
Small Outline IC |
| Package Series Name |
SO |
| JEDEC |
MS-012AC |
| Package Outline |
Link to data sheet |
|
|
MANUFACTURING INFORMATION
|
| MSL |
1 |
| Maximum reflow temperature (°C) |
260 |
| Reflow time (seconds) |
30 |
| Reflow cycles |
3 |
| standard |
J-STD-020D |
| Reflow temperature source |
Link to data sheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Lead Finish(Plating) |
Au |
| Plating materials |
Pd over Ni |
| Terminal base material |
Cu Alloy |
|
|
TYPE OF PACKAGING
|
| Packaging Suffix |
96 |
| Package |
Tape and Reel Packaging |
| Packing quantity |
2500 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
16 |
| Component Orientation |
Q1 |
| Package Type File |
Link to data sheet |
|
|
| ECAD MODELS |
|
| |
One-stop supplier of IC products