 |
|
| ■ Single device for two I/O lines |
| ■ Low capacitance for high-speed CANbus |
| ■ IEC 61000-4-2 30 kV ESD |
| ■ IEC 61000-4-5 (Level 1, CWG 1.2/50)
500 V Surge |
| ■ RoHS compliant* |
|
| CATALOG |
| CDSOT23-T24CAN COUNTRY OF ORIGIN |
| CDSOT23-T24CAN PARAMETRIC INFO |
| CDSOT23-T24CAN PACKAGE INFO |
| CDSOT23-T24CAN MANUFACTURING INFO |
| CDSOT23-T24CAN PACKAGING INFO |
| CDSOT23-T24CAN APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Taiwan (Province of China) |
| United States of America |
|
| PARAMETRIC INFO |
| Type |
TVS |
| Direction Type |
Bi-Directional |
| Maximum Working Voltage (V) |
24 |
| Configuration |
Dual |
| Capacitance Value (pF) |
30 |
| Maximum Clamping Voltage (V) |
40(Typ) |
| Maximum Leakage Current (uA) |
0.1 |
| Number of Elements per Chip |
2 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
|
| |
| PACKAGE INFO |
| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
3 |
| Lead Shape |
Gull-wing |
| PCB |
3 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
3(Max) |
| Package Width (mm) |
1.4(Max) |
| Package Height (mm) |
1.02(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.17(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
N/A |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
|
| |
| PACKAGING INFO |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Packaging Document |
Link to Datasheet |
|
| |
| APPLICATIONS |
| ■ High-speed CANbus |
| ■ Industrial control networks |
| ■ Smart Distribution Systems (SDS) |
| ■ DeviceNet™ |
| ■ Factory and process automation systems |
| ■ Lift control systems |
|
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