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• High Current Type
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• Low DC resistance
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• Magnetically shielded structure
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• Free of all RoHS-regulated substances
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• Monolithic structure for high reliability
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| CATALOG |
CIG22E1R0MNE COUNTRY OF ORIGIN
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CIG22E1R0MNE PARAMETRIC INFO
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CIG22E1R0MNE PACKAGE INFO
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CIG22E1R0MNE MANUFACTURING INFO
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CIG22E1R0MNE PACKAGING INFO
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CIG22E1R0MNE ECAD MODELS
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CIG22E1R0MNE APPLICATION
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COUNTRY OF ORIGIN
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Korea (Republic of)
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Philippines
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PARAMETRIC INFO
|
| Type |
Power |
| Technology |
Multi-Layer |
| Protection Style |
Shielded |
| Inductance (H) |
1u |
| Tolerance |
20% |
| Inductance Test Frequency (Hz) |
1M |
| Maximum DC Current (A) |
2.3 |
| Maximum Saturation Current (A) |
2.2(Typ) |
| Maximum DC Resistance (Ohm) |
0.048(Typ) |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Operating Temperature (°C) |
-40 |
| Operating Temperature (°C) |
-40 to 125 |
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PACKAGE INFO
|
| Case Size |
1008 |
| Maximum Product Length (mm) |
2.7 |
| Maximum Product Depth (mm) |
2.2 |
| Maximum Product Height (mm) |
1 |
| Maximum Product Diameter (mm) |
N/R |
| Number of Terminals |
2 |
| Product Weight (g) |
N/A |
| Terminal Pitch (mm) |
N/R |
| Mounting |
Surface Mount |
| Product Diameter (mm) |
N/R |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
10 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
5 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
N/A |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
|
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PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
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ECAD MODELS
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| APPLICATION |
| Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter |
| |