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| CATALOG |
CL21B225KAFNNNE COUNTRY OF ORIGIN
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CL21B225KAFNNNE PARAMETRIC INFO
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CL21B225KAFNNNE PACKAGE INFO
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CL21B225KAFNNNE MANUFACTURING INFO
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CL21B225KAFNNNE PACKAGING INFO
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CL21B225KAFNNNE ECAD MODELS
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COUNTRY OF ORIGIN
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China
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Korea (Republic of)
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PARAMETRIC INFO
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| Capacitance Value |
2.2uF |
| Voltage |
25VDC |
| Tolerance |
10% |
| Dielectric |
X7R |
| Technology |
Standard |
| Maximum Operating Temperature (°C) |
125 |
| Case Style |
Ceramic Chip |
| Construction |
Flat |
| Microwave Application |
Yes |
| Operating Temperature (°C) |
-55 to 125 |
| Minimum Operating Temperature (°C) |
-55 |
| Equivalent Series Resistance Type |
Low |
| DC Rated Voltage (VDC) |
25 |
| Negative Capacitance Tolerance (%) |
-10 |
| Positive Capacitance Tolerance (%) |
10 |
| Maximum Storage Temperature (°C) |
40 |
| Minimum Storage Temperature (°C) |
0 |
| Polarity |
Non Polar |
| Fixed/Variable |
Fixed |
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PACKAGE INFO
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| Package/Case |
0805 |
| Mounting |
Surface Mount |
| Termination Style |
Pad |
| Terminal Pitch (mm) |
N/R |
| Product Length (mm) |
2 |
| Product Depth (mm) |
1.25 |
| Product Height (mm) |
1.25 |
| Product Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
N/R |
| Product Weight (g) |
0.016523 |
| Number of Terminals |
2 |
| Size (mm) |
2 X 1.25 X 1.25 |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
5 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
Ni |
| Terminal Base Material |
Cu |
| Number of Wave Cycles |
N/A |
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PACKAGING INFO
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| Packaging Suffix |
E |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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