|
|
• Low thermal resistance: 96 °C/W
|
• Typical threshold level: +9 dBm
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• Low capacitance: 0.33 pF
|
• Low-profile, ultra-miniature QFN (3-pin, 2 x 2 mm) package (MSL1, 260 °C per JEDEC J-STD-020)
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|
| CATALOG |
CLA4603-085LF COUNTRY OF ORIGIN
|
CLA4603-085LF PARAMETRIC INFO
|
CLA4603-085LF PACKAGE INFO
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CLA4603-085LF MANUFACTURING INFO
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CLA4603-085LF PACKAGING INFO
|
CLA4603-085LF ECAD MODELS
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CLA4603-085LF APPLICATIONS
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|
COUNTRY OF ORIGIN
|
Malaysia
|
|
PARAMETRIC INFO
|
| Type |
Attenuator |
| Configuration |
Single Dual Anode |
| Maximum Reverse Voltage (V) |
45 |
| Maximum Continuous Forward Current (mA) |
1500 |
| Frequency Band |
HF|SHF|UHF|VHF |
| Maximum Power Dissipation (mW) |
1000 |
| Typical Carrier Life Time (us) |
0.01 |
| Maximum Diode Capacitance (pF) |
0.4@6V |
| Maximum Series Resistance @ Minimum IF (Ohm) |
2@10mA |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
200 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
QFN EP |
| Pin Count |
2 |
| PCB |
2 |
| Tab |
N/R |
| Package Length (mm) |
2 |
| Package Width (mm) |
2 |
| Package Height (mm) |
0.88 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.9 |
| Mounting |
Surface Mount |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
|
|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Low-loss, high-power limiters |
| • Receiver protectors |
| |
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