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• Low thermal resistance: 29 °C/W
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• Typical threshold level: +20 dBm
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• Low capacitance: 0.60 pF
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• Low profile, ultra-miniature QFN (3-pin, 2 x 2 mm) package(MSL1, 260 °C per JEDEC J-STD-020)
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| CATALOG |
CLA4608-085LF COUNTRY OF ORIGIN
|
CLA4608-085LF PARAMETRIC INFO
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CLA4608-085LF PACKAGE INFO
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CLA4608-085LF MANUFACTURING INFO
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CLA4608-085LF PACKAGING INFO
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CLA4608-085LF APPLICATIONS
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COUNTRY OF ORIGIN
|
Malaysia
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PARAMETRIC INFO
|
| Configuration |
Single Dual Anode |
| Maximum Reverse Voltage (V) |
180 |
| Maximum Forward Current (mA) |
1500 |
| Frequency Range |
HF|VHF|UHF|SHF |
| IF for Maximum Series Resistance (mA) |
10 |
| Test Frequency for Maximum Series Resistance (MHz) |
500 |
| VR for Maximum Diode Capacitance (V) |
38 |
| Test Frequency for Maximum Diode Capacitance (MHz) |
1 |
| IR for Maximum Reverse Voltage (uA) |
10 |
| Junction Case Thermal Resistance |
29°C/W(Typ) |
| Maximum Power Dissipation (mW) |
2000@Ta=85C |
| Typical Carrier Life Time (us) |
0.1 |
| Maximum Diode Capacitance (pF) |
0.65@38V |
| Maximum Series Resistance @ Maximum IF (Ohm) |
1.2@10mA |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
200 |
| Maximum Reverse Leakage Current (uA) |
10 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
QFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
3 |
| Lead Shape |
No Lead |
| PCB |
3 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
2 |
| Package Width (mm) |
2 |
| Package Height (mm) |
N/A |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.9 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
N/A |
| Number of Reflow Cycle |
N/A |
| Standard |
J-STD-020 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Polystyrene |
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APPLICATIONS
|
• Low-loss, high-power limiters
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• Receiver protectors
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