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• Includes NXP ISO/IEC14443-A and Innovatron ISO/IEC14443-B intellectual property
licensing rights
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• High performance multi-protocol NFC frontend for transfer speed up to 848 kbit/s
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• Supports ISO/IEC 14443 type A, MIFARE Classic, ISO/IEC 14443 B and FeliCa reader
modes
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• P2P passive initiator mode in accordance with ISO/IEC 18092
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• Supports ISO/IEC15693, ICODE EPC UID and ISO/IEC 18000-3 mode 3/ EPC Class-1
HF
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| • Low-Power Card Detection |
| • Compliance to EMV contactless protocol specification on RF level can be achieved |
| • Separate I2C-bus interface for connection of a secure access module (SAM) |
| • FIFO buffer with size of 512 bytes for highest transaction performance |
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| CATALOG |
CLRC66303HNY COUNTRY OF ORIGIN
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CLRC66303HNY PARAMETRIC INFO
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CLRC66303HNY PACKAGE INFO
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CLRC66303HNY MANUFACTURING INFO
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CLRC66303HNY PACKAGING INFO
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CLRC66303HNY APPLICATIONS
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COUNTRY OF ORIGIN
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| China |
| Taiwan (Province of China) |
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PARAMETRIC INFO
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| Module/IC Classification |
IC |
| Operation |
Read/Write |
| Frequency Range (MHz) |
13.56(Typ) |
| Memory Size |
8KByte |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Covered Range (mm) |
160 |
| Solutions |
ISM |
| ISM Band |
13.56MHz |
| Host Interface |
I2C/SPI/UART |
| Maximum Data Rate (Kbps) |
848 |
| Minimum Operating Supply Voltage (V) |
2.5 |
| Typical Operating Supply Voltage (V) |
5 |
| Maximum Operating Current (mA) |
20 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
105 |
| Minimum Storage Temperature (°C) |
-45 |
| Maximum Storage Temperature (°C) |
125 |
| RF Type |
NFC |
| Protocols Supported |
Felica|ISO/IEC 14443-A|ISO 14443-B|ISO/IEC 15693|ISO/IEC 18000-3|ISO/IEC 18092|MIFARE |
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|
PACKAGE INFO
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| Supplier Package |
HVQFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
32 |
| Lead Shape |
No Lead |
| PCB |
32 |
| Tab |
N/R |
| Package Length (mm) |
5.1(Max) |
| Package Width (mm) |
5.1(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
MO-220 |
|
|
MANUFACTURING INFO
|
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
AuAg |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
6000 |
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APPLICATIONS
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• Industrial
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| • Access control |
• Gaming
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