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• One, Two, and Four Channels of ESD Protection Note: For 6 and 8−channel Devices, See the CM1213 Data Sheet
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• Low Channel Input Capacitance of 0.85 pF Typical
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• Minimal Capacitance Change with Temperature and Voltage
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• Channel Input Capacitance Matching of 0.02 pF Typical is Ideal for Differential Dignals
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• Each CH (I/O) Pin Can Withstand Over 1000 ESD Strikes*
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| CATALOG |
CM1213A-01SO COUNTRY OF ORIGIN
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CM1213A-01SO PARAMETRIC INFO
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CM1213A-01SO PACKAGE INFO
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CM1213A-01SO MANUFACTURING INFO
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CM1213A-01SO PACKAGING INFO
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CM1213A-01SO APPLICATIONS
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COUNTRY OF ORIGIN
|
China
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PARAMETRIC INFO
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| Type |
Diode Array |
| Direction Type |
Uni-Directional |
| Maximum Working Voltage (V) |
5.5 |
| Maximum Power Dissipation (mW) |
225 |
| Configuration |
Single |
| Capacitance Value (pF) |
1.2 |
| Maximum Clamping Voltage (V) |
10(Typ)@8/20us |
| Maximum Reverse Leakage Current (uA) |
1 |
| Maximum Breakdown Voltage (V) |
9 |
| Number of Elements per Chip |
1 |
| Test Current (mA) |
10 |
| Maximum Peak Pulse Current (A) |
1@8/20us |
| Minimum Breakdown Voltage (V) |
6.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Fail Safe Protection |
No |
| Maximum Operating Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
3 |
| Lead Shape |
Gull-wing |
| PCB |
3 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
2.9 |
| Package Width (mm) |
1.3 |
| Package Height (mm) |
0.94 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.9 |
| Package Overall Width (mm) |
2.4 |
| Package Overall Height (mm) |
1 |
| Seated Plane Height (mm) |
1 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.44 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
TO-236AB |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
FeNi Alloy |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
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APPLICATIONS
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| • USB2.0 Ports at 480 Mbps in Desktop PCs, Notebooks and Peripherals |
| • IEEE1394 Firewire Ports at 400 Mbps/800 Mbps |
| • DVI Ports, HDMI Ports in Notebooks, Set Top Boxes, Digital TVs,LCD Displays |
| • Serial ATA Ports in Desktop PCs and Hard Disk Drives |
| • PCI Express Ports |
| • General Purpose High−Speed Data Line ESD Protection |
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