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• Bidirectional EMI/RFI Filtering and Line Termination with Integrated ESD Protection
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• Provides ESD Protection to IEC61000−4−2:15 kV Contact Discharge
|
• TVS Working Voltage: 5 V
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• Termination Resistors: 40
|
• Pull−up Resistors: 25 k
|
• Typical Capacitance per Line: 12 pF (VIN = 2.5 V)
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• Protection and Termination for Six Lines + Vcc
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• Solid−state Technology
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|
| CATALOG |
CM1624-08DE COUNTRY OF ORIGIN
|
CM1624-08DE LIFECYCLE
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CM1624-08DE PARAMETRIC INFO
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CM1624-08DE PACKAGE INFO
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CM1624-08DE MANUFACTURING INFO
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CM1624-08DE PACKAGING INFO
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CM1624-08DE ECAD MODELS
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CM1624-08DE APPLICATIONS
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COUNTRY OF ORIGIN
|
Malaysia
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|
LIFECYCLE
|
Obsolete
Mar 22,2024
|
|
PARAMETRIC INFO
|
| Type |
TVS |
| Direction Type |
Bi-Directional |
| Maximum Working Voltage (V) |
3 |
| Configuration |
Octal |
| Capacitance Value (pF) |
24 |
| Maximum Clamping Voltage (V) |
9 |
| Maximum Reverse Leakage Current (uA) |
0.5 |
| Number of Elements per Chip |
8 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
UDFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
No Lead |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.4 |
| Package Length (mm) |
3.3 |
| Package Width (mm) |
1.35 |
| Package Height (mm) |
0.5(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.55(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Micro Dual Flat Package No Lead, Exposed Pad |
| Package Family Name |
DFN |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
|
| |
| PACKAGING INFO |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • T−Flash / MicroSD Interfaces |
| • MMC Interfaces |
| • CDMA, GSM, 3G Cell Phones |
| |
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