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| CATALOIG |
CP2102-GMR PARAMETRIC INFO
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CP2102-GMR PACKAGE INFO
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CP2102-GMR MANUFACTURING INFO
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CP2102-GMR PACKAGING INFO
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CP2102-GMR ECAD MODELS
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PARAMETRIC INFO
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| Typical Supply Current (mA) |
200 |
| Maximum Operating Temperature (°C) |
85 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Supply Voltage (V) |
3 |
| Typical Operating Supply Voltage (V) |
3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-40 |
| Minimum Storage Temperature (°C) |
-65 |
| Protocols Supported |
USB 2.0 |
| Maximum Data Rate (Mbps) |
12 |
| Interface Type |
Serial |
| USB Speed Type |
Low Speed|Full Speed |
| Type |
USB to UART Bridge |
| USB Transceiver |
Yes |
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PACKAGE INFO
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| Supplier Package |
QFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
28 |
| Lead Shape |
No Lead |
| PCB |
28 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
5 |
| Package Width (mm) |
5 |
| Package Height (mm) |
0.88 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5 |
| Package Overall Width (mm) |
5 |
| Package Overall Height (mm) |
0.9 |
| Seated Plane Height (mm) |
0.9 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
MO-220VHHD-1 |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1500(Min) |
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ECAD MODELS
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