
|
|
• 1500Vrms Input/Output Isolation
|
• Small 4-Pin SOP Package
|
• Low Drive Power Requirements
|
• High Reliability
|
• No EMI/RFI Generation
|
• Halogen-Free
|
• Tape & Reel Version Available |
• Flammability Rating UL 94 V-0 |
|
CATALOG |
CPC1008NTR COUNTRY OF ORIGIN |
CPC1008NTR PARAMETRIC INFO
|
CPC1008NTR PACKAGE INFO
|
CPC1008NTR MANUFACTURING INFO
|
CPC1008NTR PACKAGING INFO
|
CPC1008NTR ECAD MODELS
|
CPC1008NTR APPLICATIONS
|
|
COUNTRY OF ORIGIN |
Philippines |
Mexico |
|
PARAMETRIC INFO
|
Input Type |
DC |
Maximum Input Voltage (V) |
1.5 |
Maximum Output Voltage (V) |
100 |
Maximum Input Current (mA) |
50 |
Maximum Output Current (A) |
0.15 |
I/O Isolation Voltage (V) |
1500(RMS) |
Output Device |
MOSFET |
Output Type |
AC|DC |
Maximum Turn-Off Time (ms) |
1 |
Maximum On-State Voltage Drop (V) |
1.5 |
Maximum On Resistance (Ohm) |
8 |
Maximum Turn-On Time (ms) |
2 |
Maximum Off-State Leakage Current (uA) |
1 |
Circuit Arrangement |
1 Form A |
Maximum Power Dissipation (mW) |
400 |
Typical Input to Output Capacitance (pF) |
1 |
Minimum Input Voltage (V) |
0.9 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Maximum Storage Temperature (°C) |
125 |
Minimum Storage Temperature (°C) |
-40 |
|
|
PACKAGE INFO
|
Supplier Package |
SOP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
4 |
Lead Shape |
Gull-wing |
PCB |
4 |
Tab |
N/R |
Pin Pitch (mm) |
2.54 |
Package Length (mm) |
4.09 |
Package Width (mm) |
3.81 |
Package Height (mm) |
2.08(Max) |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
2.18(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Plastic Small Outline Package |
Package Family Name |
SO |
Jedec |
N/A |
|
|
MANUFACTURING INFO
|
MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn |
Under Plating Material |
N/A |
Terminal Base Material |
N/A |
Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
Packaging Suffix |
TR |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2000 |
Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|

|
|
APPLICATIONS
|
• Instrumentation
|
• Multiplexers
|
• Data Acquisition
|
• Electronic Switching
|
• I/O Subsystems
|
• Meters (Watt-Hour, Water, Gas) |
• Medical Equipment—Patient/Equipment Isolation |
• Security Systems |
• Industrial Controls |
• Reed Relay Replacement |
|