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• Solid State Reliability
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• Handle loads up to 15Ar
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• Voltage ratings from 60V - 1000V
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• Low On Resistance
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• Compact i4-PAC™ Package with low thermal resistance and heat sink |
• Industry Standard 4-Pin SIP Package |
• Low input control current (≤ 10mA) |
• UL 508 Approval Pending |
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CATALOG |
CPC1981Y COUNTRY OF ORIGIN |
CPC1981Y PARAMETRIC INFO
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CPC1981Y PACKAGE INFO
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CPC1981Y MANUFACTURING INFO
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CPC1981Y PACKAGING INFO
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CPC1981Y APPLICATIONS |
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COUNTRY OF ORIGIN |
Mexico |
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PARAMETRIC INFO
|
Input Type |
DC |
Maximum Input Voltage (V) |
1.4 |
Maximum Output Voltage (V) |
1000 |
Maximum Input Current (mA) |
50 |
Maximum Output Current (A) |
0.18(RMS) |
I/O Isolation Voltage (V) |
2500(RMS) |
Output Device |
MOSFET |
Output Type |
AC|DC |
Maximum On Resistance (Ohm) |
18 |
Circuit Arrangement |
1 Form A |
Minimum Input Voltage (V) |
0.9 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
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PACKAGE INFO
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Supplier packaging |
Power SIP |
Number of pins |
4 |
PCB |
4 |
ears |
N/R |
Package length (mm) |
21.1 |
Package width (mm) |
3.3 |
Package height (mm) |
10.16 |
Package diameter (mm) |
N/R |
Mounting surface height (mm) |
10.16 |
Install |
Through Hole |
Packaging materials |
Plastic |
Package series name |
SIP |
JEDEC |
not applicable |
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MANUFACTURING INFO
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MSL |
1 |
Maximum reflow temperature (°C) |
245 |
Reflow soldering time (seconds) |
30 |
Number of reflow cycles |
1 |
Reflow temperature source |
Link to datasheet |
Maximum wave soldering temperature (°C) |
not applicable |
Wave soldering time (seconds) |
not applicable |
Wave soldering temperature source |
Link to datasheet |
Lead Finish(Plating) |
Sn |
Plating materials |
not applicable |
Terminal Base Material |
not applicable |
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PACKAGING INFO
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APPLICATIONS
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• Motor controls
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• Power Supplies |
• Robotics |
• Medical equipment |
• Transportation equipment |
• Consumer appliances |
• Industrial control |
• Test and Measurement Equipment |
• Aerospace/Defense |
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