CSD18537NQ5A Texas Instruments MOSFET N-CH 60V 50A 8SON

label:
2023/12/8 345


• Ultra-Low Qg and Qgd
• Low Thermal Resistance
• Avalanche Rated
• Pb Free Terminal Plating  
• RoHS Compliant
• Halogen Free  
• SON 5 mm × 6 mm Plastic Package


CATALOG
CSD18537NQ5A COUNTRY OF ORIGIN
CSD18537NQ5A PARAMETRIC INFO
CSD18537NQ5A PACKAGE INFO  
CSD18537NQ5A MANUFACTURING INFO
CSD18537NQ5A PACKAGING INFO
CSD18537NQ5A ECAD MODELS
CSD18537NQ5A APPLICATIONS


COUNTRY OF ORIGIN
China
Philippines


PARAMETRIC INFO
Channel Type N
Channel Mode Enhancement
Configuration Single Quad Drain Triple Source
Maximum Drain Source Voltage (V) 60
Material Si
Maximum Continuous Drain Current (A) 50
Maximum Absolute Continuous Drain Current (A) 54
Maximum Gate Source Voltage (V) ±20
Maximum Drain Source Resistance (mOhm) 13@10V
Typical Gate Charge @ Vgs (nC) 14@10V
ID For GFS (A) 12
VDS For GFS (V) 30
Maximum Input Capacitance @ Vds (pF) 1480@30V
Breakdown Voltage Type DSS
Operating Junction Temperature (°C) -55 to 150
Typical Gate Charge @ 10V (nC) 14
Maximum Power Dissipation (mW) 3200
Process Technology NexFET
Minimum Gate Threshold Voltage (V) 2.6
Category Power MOSFET
Typical Gate to Drain Charge (nC) 2.3
Typical Output Capacitance (pF) 136
Typical Gate to Source Charge (nC) 4.7
Maximum Junction Ambient Thermal Resistance 50°C/W
Typical Gate Resistance (Ohm) 5.5
Maximum Junction Case Thermal Resistance 2.1°C/W
Maximum Positive Gate Source Voltage (V) 20
Maximum Gate Resistance (Ohm) 11
Typical Input Capacitance @ Vds (pF) 1140@30V
Typical Gate Threshold Voltage (V) 3
Typical Reverse Transfer Capacitance @ Vds (pF) 4@30V
Typical Reverse Recovery Charge (nC) 54
Typical Diode Forward Voltage (V) 0.8
Maximum Diode Forward Voltage (V) 1
Typical Reverse Recovery Time (ns) 40
Typical Forward Transconductance (S) 62
Maximum Pulsed Drain Current @ TC=25°C (A) 151
Typical Turn-On Delay Time (ns) 5.8
Typical Turn-Off Delay Time (ns) 14.4
Typical Fall Time (ns) 3.2
Typical Rise Time (ns) 4
Maximum Gate Source Leakage Current (nA) 100
Maximum Gate Threshold Voltage (V) 3.5
Maximum IDSS (uA) 1
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150
Tradename NexFET™
 
PACKAGE INFO
Supplier Package VSONP EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 8
Lead Shape No Lead
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 4.9
Package Width (mm) 5.75
Package Height (mm) 1
Package Diameter (mm) N/R
Seated Plane Height (mm) 1
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Very Thin Small Outline No Lead, Exposed Pad
Package Family Name SON
Jedec N/A
 
MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R
 
PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Reel Width (mm) 12.4
Tape Pitch (mm) 8
Tape Width (mm) 12
Feed Hole Pitch (mm) 4
Hole Center to Component Center (mm) 2
Component Orientation Q1
Packaging Document Link to Datasheet
 
ECAD MODELS


APPLICATIONS
• High-Side Synchronous Buck Converter
• Motor Control


Продукт RFQ