Channel Type |
N |
Channel Mode |
Enhancement |
Configuration |
Single Quad Drain Triple Source |
Maximum Drain Source Voltage (V) |
60 |
Material |
Si |
Maximum Continuous Drain Current (A) |
50 |
Maximum Absolute Continuous Drain Current (A) |
54 |
Maximum Gate Source Voltage (V) |
±20 |
Maximum Drain Source Resistance (mOhm) |
13@10V |
Typical Gate Charge @ Vgs (nC) |
14@10V |
ID For GFS (A) |
12 |
VDS For GFS (V) |
30 |
Maximum Input Capacitance @ Vds (pF) |
1480@30V |
Breakdown Voltage Type |
DSS |
Operating Junction Temperature (°C) |
-55 to 150 |
Typical Gate Charge @ 10V (nC) |
14 |
Maximum Power Dissipation (mW) |
3200 |
Process Technology |
NexFET |
Minimum Gate Threshold Voltage (V) |
2.6 |
Category |
Power MOSFET |
Typical Gate to Drain Charge (nC) |
2.3 |
Typical Output Capacitance (pF) |
136 |
Typical Gate to Source Charge (nC) |
4.7 |
Maximum Junction Ambient Thermal Resistance |
50°C/W |
Typical Gate Resistance (Ohm) |
5.5 |
Maximum Junction Case Thermal Resistance |
2.1°C/W |
Maximum Positive Gate Source Voltage (V) |
20 |
Maximum Gate Resistance (Ohm) |
11 |
Typical Input Capacitance @ Vds (pF) |
1140@30V |
Typical Gate Threshold Voltage (V) |
3 |
Typical Reverse Transfer Capacitance @ Vds (pF) |
4@30V |
Typical Reverse Recovery Charge (nC) |
54 |
Typical Diode Forward Voltage (V) |
0.8 |
Maximum Diode Forward Voltage (V) |
1 |
Typical Reverse Recovery Time (ns) |
40 |
Typical Forward Transconductance (S) |
62 |
Maximum Pulsed Drain Current @ TC=25°C (A) |
151 |
Typical Turn-On Delay Time (ns) |
5.8 |
Typical Turn-Off Delay Time (ns) |
14.4 |
Typical Fall Time (ns) |
3.2 |
Typical Rise Time (ns) |
4 |
Maximum Gate Source Leakage Current (nA) |
100 |
Maximum Gate Threshold Voltage (V) |
3.5 |
Maximum IDSS (uA) |
1 |
Number of Elements per Chip |
1 |
Minimum Storage Temperature (°C) |
-55 |
Maximum Storage Temperature (°C) |
150 |
Minimum Operating Temperature (°C) |
-55 |
Maximum Operating Temperature (°C) |
150 |
Tradename |
NexFET™ |