|
|
• Half-Bridge Power Block
|
• High-Density SON 5-mm × 6-mm Footprint
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• Low RDS(ON) for Minimized Conduction Losses– 3.0-W PLoss at 30 A
|
• DualCool™ Thermally Enhanced Package
|
• Ultra-Low-Inductance Package
|
• RoHS Compliant
|
|
| CATALOG |
CSD88599Q5DC PARAMETRIC INFO
|
CSD88599Q5DC PACKAGE INFO
|
CSD88599Q5DC MANUFACTURING INFO
|
CSD88599Q5DC PACKAGING INFO
|
CSD88599Q5DC ECAD MODELS
|
CSD88599Q5DC APPLICATIONS
|
|
PARAMETRIC INFO
|
| Category |
Power Block |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
150 |
| Maximum Operating Supply Voltage (V) |
54 |
| Input Voltage (V) |
54(Max) |
| Switching Frequency (kHz) |
50 |
| Output Current (A) |
40(Max) |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Power Dissipation (mW) |
12000 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
VSON-CLIP EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
22 |
| PCB |
22 |
| Tab |
N/R |
| Package Length (mm) |
6.1(Max) |
| Package Width (mm) |
5.1(Max) |
| Package Height (mm) |
1(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.05(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Family Name |
SON |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Three-Phase Bridge for Brushless DC Motor
Control
|
| • Up to 12s Battery Power Tools |
| • Other Half and Full Bridge Topologies |
| |
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