CY22150FZXC Infineon Technologies IC CLOCK GEN PROG 16-TSSOP

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2025/05/29 15
CY22150FZXC Infineon Technologies 	IC CLOCK GEN PROG 16-TSSOP


■ Integrated phase-locked loop (PLL)
■ Commercial and industrial operation
■ Flash programmable
■ Field programmable
■ Two-wire I2C interface
■ Low skew, low jitter, high accuracy outputs
■ 3.3 V operation with 2.5 V output option


CATALOG
CY22150FZXC COUNTRY OF ORIGIN
CY22150FZXC PARAMETRIC INFO
CY22150FZXC PACKAGE INFO
CY22150FZXC MANUFACTURING INFO
CY22150FZXC PACKAGING INFO


COUNTRY OF ORIGIN
China
Philippines


PARAMETRIC INFO
Number of Outputs per Chip 6
Clock Input Frequency (MHz) 1 to 133
Maximum Output Frequency (MHz) 200
Typical Duty Cycle (%) 50
Input Logic Level CMOS|Crystal
Output Logic Level CMOS
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 70
Supplier Temperature Grade Commercial
Programmability Yes
Minimum Operating Supply Voltage (V) 3.135
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.465
Maximum Power Dissipation (mW) 450
Number of Clock Inputs 1
Spread Spectrum No


PACKAGE INFO
Supplier Package TSSOP
Basic Package Type Lead-Frame SMT
Pin Count 16
Lead Shape Gull-wing
PCB 16
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 5.1(Max)
Package Width (mm) 4.5(Max)
Package Height (mm) 0.95(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.1(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Thin Shrink Small Outline Package
Package Family Name SO
Jedec MO-153AB
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed|Au
Under Plating Material N/A|Pd over Ni
Terminal Base Material Cu


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 960


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