|
|
• USB 2.0 Hub
|
• Four Downstream Ports
|
• Multiple Transaction Translators - One per Downstream Port for Maximum Performance
|
| • VID, PID, and DID configured from External SPI EEPROM
|
| • 24 MHz External Crystal |
| • Small Package - Quad Flat Pack, No Leads (QFN) |
| • Integrated Upstream Pull Up Resistor |
| • Integrated Downstream Pull Down Resistors for all Downstream Ports |
| • Integrated Upstream and Downstream Series Termination Resistors |
• Configurable with External SPI EEPROM❐ Number of Active Ports❐ Number of Removable Ports❐ Maximum Power❐ Hub Controller Power❐ Power On Timer
❐ Over current Timer❐ Disable Over current Timer❐ Enable Full Speed Only❐ Disable Port Indicators❐ Gang Power Switching❐ Enable Single TT Mode Only❐ Enable NoEOP at EOF1 |
| |
| CATALOG |
| CY7C65640A-LTXCT COUNTRY OF ORIGIN |
| CY7C65640A-LTXCT LIFECYCLE |
CY7C65640A-LTXCT PARAMETRIC INFO
|
CY7C65640A-LTXCT PACKAGE INFO
|
CY7C65640A-LTXCT MANUFACTURING INFO
|
CY7C65640A-LTXCT PACKAGING INFO
|
CY7C65640A-LTXCT EACD MODELS
|
| CY7C65640A-LTXCT APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Indonesia |
| Philippines |
| Taiwan (Province of China) |
|
| LIFECYCLE |
Obsolete
Jul 03,2019 |
| |
PARAMETRIC INFO
|
| Typical Supply Current (mA) |
460 |
| Maximum Operating Temperature (°C) |
70 |
| Maximum Operating Supply Voltage (V) |
3.45 |
| Minimum Operating Supply Voltage (V) |
3.15 |
| Typical Operating Supply Voltage (V) |
3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
0 |
| Minimum Storage Temperature (°C) |
-65 |
| Protocols Supported |
USB 2.0 |
| Interface Type |
SPI |
| Maximum Operating Frequency (MHz) |
24 |
| USB Speed Type |
High Speed |
| Type |
Hub Controller |
| Process Technology |
CMOS |
| USB Transceiver |
Yes |
|
|
PACKAGE INFO
|
| Supplier Package |
QFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
56 |
| Lead Shape |
No Lead |
| PCB |
56 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
8 |
| Package Width (mm) |
8 |
| Package Height (mm) |
0.9 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.9 |
| Mounting |
Surface Mount |
| Package Weight (g) |
0.162 |
| Package Material |
Plastic |
| Package Description |
Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
N/A |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
N/R |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
| |
| APPLICATIONS |
| • Standalone Hubs |
| • Motherboard Hubs |
| • Monitor Hub applications |
| • External Personal Storage Drives |
| • Port Replicators |
| • Portable Drive |
| • Docking Stations |
| |
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