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• Operating characteristics
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• Performance
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• Memories
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| • Digital peripherals
|
| • Programmable clocking |
| • Analog peripherals |
| • Versatile I/O system |
| • Programming, debug, and trace |
| • Package options: 68-pin QFN, 100-pin TQFP, and 99-pin CSP |
| • Development support with free PSoC Creator™ tool |
| |
| CATALOG |
| CY8C5868AXI-LP035 COUNTRY OF ORIGIN |
CY8C5868AXI-LP035 PARAMETRIC INFO
|
CY8C5868AXI-LP035 PACKAGE INFO
|
CY8C5868AXI-LP035 MANUFACTURING INFO
|
CY8C5868AXI-LP035 PACKAGING INFO
|
CY8C5868AXI-LP035 EACD MODELS
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|
| COUNTRY OF ORIGIN |
| United States of America |
| Taiwan (Province of China) |
|
PARAMETRIC INFO
|
| Series name |
CY8Cxxx |
| Data Bus Width (bit) |
32 |
| Device Core |
ARM Cortex M3 |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
67 |
| Program Memory Type |
Flash |
| Program Memory Size |
256KB |
| RAM Size |
64KB |
| Maximum Expanded Memory Size |
4GB |
| Maximum CPU Frequency (MHz) |
67 |
| Floating Point Unit |
no |
| Bluetooth |
no |
| Wi-Fi |
no |
| External Bus Interface |
no |
| DMA Channels |
twenty four |
| Multiply Accumulate |
no |
| Internal/External Clock Type |
External |
| Touch Sensing Interface |
no |
| Power On Reset |
yes |
| Memory Protection Unit |
no |
| Temperature Sensor |
yes |
| DDR |
no |
| Memory Management Unit |
yes |
| Integrated Development Environment |
no |
| Super Scalar |
no |
| EEPROM |
2KB |
| Direct Memory Access |
yes |
| Number of Programmable I/Os |
72 |
| Number of Timers |
4 |
| ADC Channels |
1/2 |
| DAC Channels |
4 |
| ADC Resolution (bit) |
20/12/12 |
| Core Architecture |
ARM |
| Number of ADCs |
Triple |
| Number of DACs |
Quad |
| DAC Resolution (bit) |
8/8/8/8 |
| PWM |
4 |
| Watchdog |
1 |
| Parallel Master Port |
no |
| Real Time Clock |
yes |
| Special Features |
CAN Controller |
| Interface Type |
CAN/I2C/SPI/UART/USB |
| Programmability |
yes |
| SPI |
1 |
| I2C |
1 |
| I2S |
0 |
| Process Technology |
CMOS |
| UART |
1 |
| USART |
0 |
| CAN |
1 |
| USB |
1 |
| Ethernet |
0 |
| Minimum Operating Supply Voltage (V) |
1.71|1.8 |
| Typical Operating Supply Voltage (V) |
1.8|3.3|5 |
| Maximum Operating Supply Voltage (V) |
1.89|5.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Supplier Temperature Rating |
Industrial |
| Operating Supply Voltage (V) |
1.8|3.3|5 |
| Maximum Storage Temperature (°C) |
100 |
| Minimum Storage Temperature (°C) |
-55 |
|
|
PACKAGE INFO
|
| Supplier packaging |
TQFP |
| Basic package type |
Lead-Frame SMT |
| Number of pins |
100 |
| Pin shape |
Gull-wing |
| PCB |
100 |
| ears |
N/R |
| Pin spacing (mm) |
0.5 |
| Package length (mm) |
14 |
| Package width (mm) |
14 |
| Package height (mm) |
1.4 |
| Package diameter (mm) |
N/R |
| Package Overall Length (mm) |
16 |
| Package Overall Width (mm) |
16 |
| Package Overall Height (mm) |
1.6(Max) |
| Mounting surface height (mm) |
1.6(Max) |
| Install |
Surface Mount |
| Package weight (g) |
not applicable |
| Packaging materials |
Plastic |
| package instruction |
Thin Quad Flat Package |
| Package series name |
QFP |
| JEDEC |
MS-026 |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
30 |
| Number of reflow cycles |
3 |
| standard |
J-STD-020D |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Wave soldering temperature source |
Link to datasheet |
| Lead Finish(Plating) |
Au |
| Plating materials |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Package |
Tray |
| Packing quantity |
900 |
|
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ECAD MODELS
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