|
|
• Relative Accuracy: 8LSB
|
• Glitch Energy: 0.1 nV-s
|
• MicroPower Operation: 140 μA at 2.7 V
|
• Power-On Reset to Zero
|
• Power Supply: 2.7 V to 5.5 V
|
• 16-Bit Monotonic
|
• Settling Time: 10 μs to ±0.003% FSR
|
• Low-Power Serial Interface with
Schmitt-Triggered Inputs
|
• On-Chip Output Buffer Amplifier with
Rail-to-Rail Operation
|
• Power-Down Capability
|
• Binary Input
|
• SYNC Interrupt Facility
|
• Drop-In Compatible With DAC85x1
and DAC8550 (2's Complement Input)
|
|
| CATALOG |
| DAC8551IADGKT COUNTRY OF ORIGIN |
DAC8551IADGKT PARAMETRIC INFO
|
DAC8551IADGKT PACKAGE INFO
|
DAC8551IADGKT MANUFACTURING INFO
|
DAC8551IADGKT PACKAGING INFO
|
DAC8551IADGKT ECAD MODELS
|
DAC8551IADGKT FUNCTIONAL BLOCK DIAGRAM
|
DAC8551IADGKT APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
| China |
Thailand
|
|
PARAMETRIC INFO
|
| Architecture |
Resistor-String |
| Resolution |
16bit |
| Number of DAC Channels |
1 |
| Number of Outputs per Chip |
1 |
| Conversion Rate |
200ksps |
| Converter Type |
General Purpose |
| Output Type |
Voltage |
| Voltage Reference |
External |
| Maximum Settling Time (us) |
12(Typ) |
| Digital Interface Type |
Serial (3-Wire, SPI, QSPI, Microwire) |
| Output Polarity |
Unipolar |
| Integral Nonlinearity Error |
±16LSB |
| Full Scale Error |
±0.5%FSR |
| Signal to Noise Ratio |
95dB(Typ) |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
105 |
| Power Supply Type |
Single |
| Minimum Single Supply Voltage (V) |
2.7 |
| Typical Single Supply Voltage (V) |
3.3|5 |
| Maximum Single Supply Voltage (V) |
5.5 |
| Digital Supply Support |
No |
|
|
PACKAGE INFO
|
| Supplier Package |
VSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
3.1(Max) |
| Package Width (mm) |
3.1(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.1(Max) |
| Package Overall Width (mm) |
5.05(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-187AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
PdNiAg |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
250 |
| Reel Diameter (in) |
7.09 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
FUNCTIONAL BLOCK DIAGRAM
|
|
|
| APPLICATION |
• Process Control
|
• Data Acquisition Systems
|
• Closed-Loop Servo-Control
|
• PC Peripherals
|
| • Portable Instrumentation |
• Programmable Attenuation
|
| |
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