|
|
• Current output: 4 mA to 20 mA;
0 mA to 20 mA; 0 mA to 24 mA
|
• Voltage output:
– 0 V to 5 V; 0 V to 10 V; ±5 V; ±10 V
– 0 V to 5.5 V; 0 V to 11 V; ±5.5 V; ±11 V
(10% overrange)
|
• ±0.1% FSR total unadjusted error (TUE) maximum
|
• DNL: ±1 LSB maximum
|
• Simultaneous voltage and current output
|
• Internal 5-V reference (10 ppm/°C, maximum)
|
• Internal 4.6-V power-supply output
|
• Reliability features:
– CRC check and watchdog timer
– Thermal alarm
– Open alarm, short current limit
|
• Wide temperature range: –40°C to 125°C
|
• Packages: 6-mm × 6-mm 40-pin VQFN and 24-pin
HTSSOP
|
|
| CATALOG |
| DAC8760IPWPR COUNTRY OF ORIGIN |
DAC8760IPWPR PARAMETRIC INFO
|
DAC8760IPWPR PACKAGE INFO
|
DAC8760IPWPR MANUFACTURING INFO
|
DAC8760IPWPR PACKAGING INFO
|
DAC8760IPWPR ECAD MODELS
|
DAC8760IPWPR FUNCTIONAL BLOCK DIAGRAM
|
DAC8760IPWPR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
| Taiwan (Province of China) |
|
PARAMETRIC INFO
|
| Architecture |
Resistor-String |
| Resolution |
16bit |
| Number of DAC Channels |
1 |
| Number of Outputs per Chip |
2 |
| Conversion Rate |
40ksps |
| Converter Type |
General Purpose |
| Output Type |
Current|Voltage |
| Voltage Reference |
Internal|External |
| Maximum Settling Time (us) |
25(Typ) |
| Digital Interface Type |
Serial (4-Wire, SPI, QSPI, Microwire) |
| Output Polarity |
Unipolar|Bipolar |
| Integral Nonlinearity Error |
±0.08%FSR |
| Full Scale Error |
±0.29%FSR |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Power Supply Type |
Single|Dual |
| Minimum Single Supply Voltage (V) |
10 |
| Typical Single Supply Voltage (V) |
12|15|18|24|28 |
| Maximum Single Supply Voltage (V) |
36 |
| Maximum Dual Supply Voltage (V) |
±18 |
| Digital Supply Support |
Yes |
| Maximum Power Dissipation (mW) |
170 |
|
|
PACKAGE INFO
|
| Supplier Package |
HTSSOP EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
Gull-wing |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
7.9(Max) |
| Package Width (mm) |
4.5(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
7.9(Max) |
| Package Overall Width (mm) |
6.6(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Heat Sinked Thin Shrink Small Outline Package, Exposed Pad |
| Package Family Name |
SOP |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
16 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
FUNCTIONAL BLOCK DIAGRAM
|
|
|
APPLICATIONS
|
• Analog output module
|
• CPU (PLC controller)
|
• HVAC valve and actuator control
|
• Flow transmitter
|
• Other sensor transmitter
|
• Actuator
|
|
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