 |
|
| • Small, Low Profile Surface Mount Package |
| • Very Sharp Breakdown Characteristics |
| • Ideally Suited for Automated Assembly Processes |
| • Very Low Leakage Current
|
| • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) |
| • Halogen and Antimony Free. “Green” Device (Note 3)
|
|
| CATALOG |
| DDZ9692T-7 COUNTRY OF ORIGIN |
| DDZ9692T-7 PARAMETRIC INFO |
| DDZ9692T-7 PACKAGE INFO |
| DDZ9692T-7 MANUFACTURING INFO |
| DDZ9692T-7 PACKAGING INFO |
|
| COUNTRY OF ORIGIN |
| China |
|
| PARAMETRIC INFO |
| Type |
Voltage Regulator |
| Configuration |
Single |
| Nominal Zener Voltage (V) |
6.8 |
| Maximum Reverse Leakage Current (uA) |
0.1 |
| Maximum Power Dissipation @ 25C (mW) |
150 |
| Maximum Power Dissipation (mW) |
150 |
| Test Current (mA) |
0.05 |
| Zener Voltage Tolerance |
5% |
| Minimum Operating Temperature (°C) |
-65 |
| Maximum Operating Temperature (°C) |
150 |
|
| |
| PACKAGE INFO |
| Supplier Package |
SOD-523 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
Flat |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
1.3(Max) |
| Package Width (mm) |
0.9(Max) |
| Package Height (mm) |
0.65(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.65(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Small Outline Diode Package |
| Package Family Name |
SOD |
| Jedec |
SOD-523 |
|
| |
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Alloy 42 |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
7 |
| Packaging |
Tape and Reel |
| Packaging Document |
Link to Datasheet |
|
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