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| CATALOG |
| DF40HC(2.5)-60DS-0.4V(51) COUNTRY OF ORIGIN |
DF40HC(2.5)-60DS-0.4V(51) PARAMETRIC INFO
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DF40HC(2.5)-60DS-0.4V(51) PACKAGE INFO
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DF40HC(2.5)-60DS-0.4V(51) MANUFACTURING INFO
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DF40HC(2.5)-60DS-0.4V(51) PACKAGING INFO
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DF40HC(2.5)-60DS-0.4V(51) EACD MODELS
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| COUNTRY OF ORIGIN |
| Japan |
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PARAMETRIC INFO
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| Type |
Board to Board |
| Gender |
RCP |
| Number of Contacts |
60 |
| Termination Method |
Solder |
| Maximum Current Rating (A) |
0.3 |
| Maximum Voltage Rating |
50VDC|50VAC |
| Housing Material |
Liquid Crystal Polymer |
| Housing Color |
Black |
| Contact Material |
Phosphor Bronze |
| Contact Plating |
Gold Over Nickel |
| Maximum Contact Resistance (mOhm) |
90 |
| Insulation Resistance (MOhm) |
50 |
| Operating Temperature (°C) |
-55 to 85 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
85 |
| Mating Cycle (Cycles) |
30 |
| Minimum Storage Temperature (°C) |
-10 |
| Maximum Storage Temperature (°C) |
60 |
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PACKAGE INFO
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| Terminal Pitch (mm) |
0.4 |
| Body Orientation |
Straight |
| Mounting |
Surface Mount |
| Product Length (mm) |
14.6 |
| Product Depth (mm) |
3.38 |
| Product Height (mm) |
2.4 |
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MANUFACTURING INFO
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| MSL |
N/A |
| Maximum Reflow Temperature (°C) |
250 |
| Reflow Solder Time (Sec) |
N/A |
| Number of Reflow Cycle |
2 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
N/A |
| Under Plating Material |
N/A |
| Terminal Base Material |
Phosphor-Bronze |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
51 |
| Packaging |
Tape and Reel |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
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ECAD MODELS
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