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• Guard Ring Die Construction for Transient Protection
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• Low Power Loss, High Efficiency
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• High Surge Capability
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| • High Current Capability and Low Forward Voltage Drop |
| • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) |
| • Halogen and Antimony Free. “Green” Device (Note 3) |
| • An Automotive-Compliant Part is Available Under Separate Datasheet (DFLS240LQ) |
| |
| CATALOG |
| DFLS240L-7 COUNTRY OF ORIGIN |
DFLS240L-7 PARAMETRIC INFO
|
DFLS240L-7 PACKAGE INFO
|
DFLS240L-7 MANUFACTURING INFO
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DFLS240L-7 PACKAGING INFO
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|
| COUNTRY OF ORIGIN |
| China |
|
PARAMETRIC INFO
|
| Type |
Schottky Diode |
| Configuration |
Single |
| Maximum DC Reverse Voltage (V) |
40 |
| Peak Reverse Repetitive Voltage (V) |
40 |
| Maximum Continuous Forward Current (A) |
2 |
| Maximum Power Dissipation (mW) |
1670 |
| Maximum Junction Ambient Thermal Resistance |
180°C/W(Typ) |
| Peak Forward Voltage (V) |
0.65@3A |
| Maximum RMS Reverse Voltage (V) |
28 |
| Peak Non-Repetitive Surge Current (A) |
50 |
| Peak Reverse Current (uA) |
100 |
| Operating Junction Temperature (°C) |
-55 to 125 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| Maximum Diode Capacitance (pF) |
90(Typ) |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
125 |
|
| |
PACKAGE INFO
|
| Supplier Package |
PowerDI 123 |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
No Lead |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
2.8 |
| Package Width (mm) |
1.78 |
| Package Height (mm) |
0.98 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.7 |
| Package Overall Width (mm) |
1.78 |
| Package Overall Height (mm) |
0.98 |
| Seated Plane Height (mm) |
0.98 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
N/A |
| Package Family Name |
PowerDI 123 |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
| |
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu |
| Number of Wave Cycles |
N/R |
|
| |
PACKAGING INFO
|
| Packaging Suffix |
7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Cathode At Sprocket Hole |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
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