DM3AT-SF-PEJM5 Hirose Connector CONN MICRO SD CARD PUSH-PUSH R/A

label:

2023/12/15 301

◆ Common to the entire Series
. Extremely small in size Small external dimensions and the above-the-board height make the connectors the smallest on the market.
. Reverse card insertion protection Unique card slot design (patented) protects the connector from damage when the card is attempted to be inserted in reverse, allowing it to re-inserted correctly.
. Effective ground and shield configuration 4-connection points of the metal cover to the printed circuit board assures secure connection of the ground circuit and provides EMI protection.
. Rigid and strong construction Despite its small size, high-strengths materials used in the connectors produced a strong and rigid structure.
. Card detection switch The card detection switch is Normally Open

◆ DM3AT and DM3BT (Push - Push, with ejection mechanism)
· Card fall-out prevention Built-in card tray and the unique push insertion-push ejection mechanism (patented) prevent accidental card ejection or fallout.
· Despite its small size the connectors will eject the card to a distance of 4.0mm, allowing easy hold and removal of the card.
· Exposed termination leads Easy inspection and rework of the solder termination joints.

◆ DM3CS (Hinge, Push-Pull, manual, without ejection mechanism)
· Simple and reliable card insertion Hinged metal cover provides location and guides the card during the insertion / removal. Closing of the cover confirms the electrical and mechanical connection with a tactile click sensation.
· Reliable contact with the card contact pads Unique contact design and card slide action will clean the contact areas of the card.
· Accessible termination areas Contact solder terminations may be inspected and reworked.

◆ DM3D (Push -Pull, manual, without ejection mechanism)
· Partial card insertion hold Card will not fall-out even when it is not fully inserted. Full insertion and electrical / mechanical connection is confirmed with a distinct tactile feel.
· Accessible termination areas An inner lead system that can be reworked is used in this design. Contact solder terminations may be inspected and reworked.

CATALOG

DM3AT-SF-PEJM5 COUNTRY OF ORIGIN

DM3AT-SF-PEJM5 PARAMETRIC INFO

DM3AT-SF-PEJM5 PACKAGE INFO

DM3AT-SF-PEJM5 MANUFACTURING INFO

DM3AT-SF-PEJM5 PACKAGING INFO

DM3AT-SF-PEJM5 ECAD MODELS

COUNTRY OF ORIGIN

Japan

China

PARAMETRIC INFO

Type	Micro SD Card
Gender	HDR
Number of Contacts	8
Termination Method	Solder
Tradename	microSD™
Maximum Current Rating (A)	0.5
Maximum Voltage Rating	125VAC
Ejector Type	Push-Push
Terminal Plating	Gold
Contact Material	Copper Alloy
Contact Plating	Gold
Housing Material	Liquid Crystal Polymer
Insulation Resistance (MOhm)	1000
Maximum Contact Resistance (mOhm)	100
Number of Rows	1
Operating Temperature (°C)	-25 to 85
Minimum Operating Temperature (°C)	-25
Maximum Operating Temperature (°C)	85
Mating Cycle (Cycles)	10000
PCB Mounting Side	Normal
Maximum Terminal Width (mm)	0.45
Maximum Terminal Coplanarity (mm)	0.1
Minimum Storage Temperature (°C)	-40
Maximum Storage Temperature (°C)	85

PACKAGE INFO

Terminal Pitch (mm)	1.1
Body Orientation	Right Angle
Mounting	Surface Mount
Product Length (mm)	13.85
Product Depth (mm)	15.95
Product Height (mm)	1.68
Length Tolerance (mm)	±0.2
Depth Tolerance (mm)	±0.2
Height Tolerance (mm)	±0.15
Product Weight (g)	0.56

MANUFACTURING INFO

MSL	N/A
Maximum Reflow Temperature (°C)	250
Reflow Solder Time (Sec)	N/A
Number of Reflow Cycle	2
Standard	N/A
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Au
Under Plating Material	N/A
Terminal Base Material	Cu Alloy
Number of Wave Cycles	N/R

PACKAGING INFO

Packaging	Tape and Reel
Quantity Of Packaging	1500
Reel Diameter (in)	14.96
Reel Width (mm)	32.4
Tape Pitch (mm)	20
Tape Width (mm)	32
Feed Hole Pitch (mm)	4
Hole Center to Component Center (mm)	2
Packaging Document	Link to Datasheet
Tape Type	Embossed

ECAD MODELS