DM3D-SF Hirose Connector CONN MICRO SD CARD PUSH-PULL

label:
2024/03/1 261



• Common to the entire Series
• Reverse card insertion protection
• Effective ground and shield configuration
• DM3AT and DM3BT (Push - Push, with ejection mechanism)
• DM3CS (Hinge, Push-Pull, manual, without ejection mechanism)
• DM3D (Push -Pull, manual, without ejection mechanism)


CATALOG
DM3D-SF COUNTRY OF ORIGIN
DM3D-SF PARAMETRIC INFO
DM3D-SF PACKAGE INFO
DM3D-SF MANUFACTURING INFO
DM3D-SF PACKAGING INFO
DM3D-SF ECAD MODELS


COUNTRY OF ORIGIN
Japan


PARAMETRIC INFO
type Micro SD Card
Gender HDR
Number of Contacts 8
Termination Method Solder
Tradename microSD™
Maximum Current Rating (A) 0.5
Maximum Voltage Rating 125VAC
Ejector Type Push Pull
Terminal Plating Gold
Contact Material Copper Alloy
Contact Plating Gold
Housing Material Liquid Crystal Polymer
Insulation Resistance (MOhm) 1000
Maximum Contact Resistance (mOhm) 100
Number of Rows 1
Operating Temperature (°C) -25 to 85
Minimum Operating Temperature (°C) -25
Maximum Operating Temperature (°C) 85
Mating Cycles (Cycles) 5000
PCB Mounting Side Normal
Minimum Storage Temperature (°C) -40
Maximum Storage Temperature (°C) 85


PACKAGE INFO
Terminal Pitch (mm) 1.1
Body Orientation Right Angle
Install Surface Mount
Product Length (mm) 11.95
Product Depth (mm) 11.45
Product Height (mm) 1.55


MANUFACTURING INFO
MSL not applicable
Maximum reflow temperature (°C) 250
Reflow soldering time (seconds) not applicable
Number of reflow cycles 2
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Lead Finish(Plating) Au
Plating materials not applicable
Terminal Base Material Cu Alloy


PACKAGING INFO
Package Tape and reel packaging
Packing quantity 2000
packaging type file Link to datasheet
Tape Type Embossed


ECAD MODELS

Продукт RFQ