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• Common to the entire Series
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• Reverse card insertion protection
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• Effective ground and shield configuration
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• DM3AT and DM3BT (Push - Push, with ejection mechanism)
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• DM3CS (Hinge, Push-Pull, manual, without ejection mechanism) |
• DM3D (Push -Pull, manual, without ejection mechanism) |
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CATALOG |
DM3D-SF COUNTRY OF ORIGIN |
DM3D-SF PARAMETRIC INFO
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DM3D-SF PACKAGE INFO
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DM3D-SF MANUFACTURING INFO
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DM3D-SF PACKAGING INFO
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DM3D-SF ECAD MODELS
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COUNTRY OF ORIGIN |
Japan |
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PARAMETRIC INFO
|
type |
Micro SD Card |
Gender |
HDR |
Number of Contacts |
8 |
Termination Method |
Solder |
Tradename |
microSD™ |
Maximum Current Rating (A) |
0.5 |
Maximum Voltage Rating |
125VAC |
Ejector Type |
Push Pull |
Terminal Plating |
Gold |
Contact Material |
Copper Alloy |
Contact Plating |
Gold |
Housing Material |
Liquid Crystal Polymer |
Insulation Resistance (MOhm) |
1000 |
Maximum Contact Resistance (mOhm) |
100 |
Number of Rows |
1 |
Operating Temperature (°C) |
-25 to 85 |
Minimum Operating Temperature (°C) |
-25 |
Maximum Operating Temperature (°C) |
85 |
Mating Cycles (Cycles) |
5000 |
PCB Mounting Side |
Normal |
Minimum Storage Temperature (°C) |
-40 |
Maximum Storage Temperature (°C) |
85 |
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PACKAGE INFO
|
Terminal Pitch (mm) |
1.1 |
Body Orientation |
Right Angle |
Install |
Surface Mount |
Product Length (mm) |
11.95 |
Product Depth (mm) |
11.45 |
Product Height (mm) |
1.55 |
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MANUFACTURING INFO
|
MSL |
not applicable |
Maximum reflow temperature (°C) |
250 |
Reflow soldering time (seconds) |
not applicable |
Number of reflow cycles |
2 |
Reflow temperature source |
Link to datasheet |
Maximum wave soldering temperature (°C) |
N/R |
Wave soldering time (seconds) |
N/R |
Lead Finish(Plating) |
Au |
Plating materials |
not applicable |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
|
Package |
Tape and reel packaging |
Packing quantity |
2000 |
packaging type file |
Link to datasheet |
Tape Type |
Embossed |
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ECAD MODELS
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