 |
|
| • Low On-Resistance |
| • Very Low Gate Threshold Voltage (1.0V max) |
| • Low Input Capacitance |
| • Fast Switching Speed |
| • Low Input/Output Leakage |
| • ESD Protected Up To 2kV |
| • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) |
| • Halogen- and Antimony-Free. “Green” Device (Note 3) |
| • For automotive applications requiring specific change control
(i.e.: parts qualified to AEC-Q100/101/200, PPAP capable, and
manufactured in IATF 16949 certified facilities), please refer
to the related automotive grade (Q-suffix) part. A listing can
be found |
| • This part is qualified to JEDEC standards (as references in
AEC-Q) for High-Reliability. |
| • An Automotive-Compliant Part is Available Under Separate
Datasheet |
|
| CATALOG |
| DMN5L06K-7 COUNTRY OF ORIGIN |
| DMN5L06K-7 PARAMETRIC INFO |
| DMN5L06K-7 PACKAGE INFO |
| DMN5L06K-7 MANUFACTURING INFO |
| DMN5L06K-7 PACKAGING INFO |
| DMN5L06K-7 APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| China |
|
| PARAMETRIC INFO |
| Channel Type |
N |
| Channel Mode |
Enhancement |
| Configuration |
Single |
| Maximum Drain Source Voltage (V) |
50 |
| Maximum Continuous Drain Current (A) |
0.3 |
| Maximum Gate Source Voltage (V) |
±20 |
| Maximum Drain Source Resistance (mOhm) |
2000@5V |
| Maximum Power Dissipation (mW) |
350 |
| Category |
Small Signal |
| Typical Input Capacitance @ Vds (pF) |
50(Max)@25V |
| Number of Elements per Chip |
1 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-65 |
| Maximum Operating Temperature (°C) |
150 |
|
|
| PACKAGE INFO |
| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
3 |
| Lead Shape |
Gull-wing |
| PCB |
3 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.92 |
| Package Length (mm) |
2.9 |
| Package Width (mm) |
1.3 |
| Package Height (mm) |
0.98 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.9 |
| Package Overall Width (mm) |
2.4 |
| Package Overall Height (mm) |
1.03 |
| Seated Plane Height (mm) |
1.03 |
| Mounting |
Surface Mount |
| Package Weight (g) |
0.008 |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
TO-236AB |
| Package Outline |
Link to Datasheet |
|
|
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Alloy 42 |
| Number of Wave Cycles |
N/R |
|
|
| PACKAGING INFO |
| Packaging Suffix |
7 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Single Pin At Sprocket Hole |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
|
|
| APPLICATIONS |
| This new generation 50V N-channel enhancement mode MOSFET is
designed to minimize RDS(on) yet maintain superior switching
performance. This device is ideal for use in Notebook battery power
management and load switches. |
| • Load Switches |
| • Level Switches |
| |
|
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