DMP2160UFDB-7 Diodes Incorporated MOSFET 2P-CH 20V 3.8A 6UDFN

label:
2025/12/11 23
DMP2160UFDB-7 Diodes Incorporated 	MOSFET 2P-CH 20V 3.8A 6UDFN


• Low Gate Threshold Voltage, -0.9V Max
• Fast Switching Speed
• Low Input/Output Leakage
• Low Profile, 0.5mm Max Height
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)


CATALOG
DMP2160UFDB-7 PARAMETRIC INFO
DMP2160UFDB-7 PACKAGE INFO
DMP2160UFDB-7 MANUFACTURING INFO
DMP2160UFDB-7 PACKAGING INFO
DMP2160UFDB-7 ECAD MODELS


PARAMETRIC INFO
Channel Type P
Channel Mode Enhancement
Configuration Dual
Maximum Drain-Source Voltage (V) 20
Maximum Continuous Drain Current (A) 3.8
Maximum Absolute Continuous Drain Current (A) 3.8
Maximum Gate-Source Voltage (V) ±12
Maximum Drain-Source Resistance (mOhm) 70@4.5V
Typical Gate Charge @ Vgs (nC) 6.5@4.5V
Maximum Power Dissipation (mW) 1400
Category Power MOSFET
Typical Input Capacitance @ Vds (pF) 536@10V
Typical Turn-On Delay Time (ns) 11.51
Typical Turn-Off Delay Time (ns) 55.34
Typical Fall Time (ns) 27.54
Typical Rise Time (ns) 12.09
Number of Elements per Chip 2
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150


PACKAGE INFO
Supplier Package UDFN EP
Pin Count 6
PCB 6
Tab N/R
Package Length (mm) 2
Package Width (mm) 2
Package Height (mm) 0.56
Package Diameter (mm) N/R
Mounting Surface Mount
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix 7
Packaging Tape and Reel
Quantity Of Packaging 3000
Packaging Document Link to Datasheet


ECAD MODELS

Продукт RFQ