DMP6023LFGQ-7 Diodes Incorporated MOSFET P-CH 60V 7.7A PWRDI3333-8

label:
2025/08/18 13



• Low RDS(ON) – Ensures on State Losses Are Minimized
• Small Form Factor Thermally Efficient Package Enables Higher Density End Products
• Occupies just 33% of the Board Area Occupied by SO-8 Enabling Smaller End Product
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)


CATALOG
DMP6023LFGQ-7 COUNTRY OF ORIGIN
DMP6023LFGQ-7 PARAMETRIC INFO
DMP6023LFGQ-7 PACKAGE INFO
DMP6023LFGQ-7 MANUFACTURING INFO
DMP6023LFGQ-7 PACKAGING INFO
DMP6023LFGQ-7 APPLICATIONS


COUNTRY OF ORIGIN
China


PARAMETRIC INFO
Channel Type P
Channel Mode Enhancement
Configuration Single Quad Drain Triple Source
Maximum Drain-Source Voltage (V) 60
Maximum Continuous Drain Current (A) 7.7
Maximum Gate-Source Voltage (V) ±20
Maximum Drain-Source Resistance (mOhm) 25@10V
Typical Gate Charge @ Vgs (nC) 26.5@4.5V|53.1@10V
Typical Gate Charge @ 10V (nC) 53.1
Maximum Power Dissipation (mW) 2100
Category Power MOSFET
Typical Input Capacitance @ Vds (pF) 2569@30V
Typical Turn-On Delay Time (ns) 6
Typical Turn-Off Delay Time (ns) 110
Typical Fall Time (ns) 62
Typical Rise Time (ns) 7.1
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150
Supplier Temperature Grade Automotive


PACKAGE INFO
Supplier Package PowerDI EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 8
Lead Shape No Lead
PCB 8
Tab N/R
Package Length (mm) 3.3
Package Width (mm) 3.3
Package Height (mm) 0.78
Package Diameter (mm) N/R
Mounting Surface Mount
Package Outline Link to Datasheet


MANUFACTURING INFO
Lead Finish(Plating) Matte Sn annealed


PACKAGING INFO
Packaging Suffix 7
Packaging Tape and Reel
Quantity Of Packaging 2000
Packaging Document Link to Datasheet

APPLICATIONS
• Backlighting
• Power-management functions
• DC-DC converters
Продукт RFQ