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• IEEE 1588 V1 and V2 Supported
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• IEEE 1588 Clock Synchronization
|
• 12 IEEE 1588 GPIOs for Trigger or Capture
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• Deterministic, Low Transmit and Receive Latency
|
• Selectable Frequency Synchronized Clock Output
|
• Dynamic Link Quality Monitoring
|
• 10/100 Mb/s Packet BIST (Built-in Self Test)
|
• Error-Free Operation up to 150 Meters CAT5
|
|
| CATALOG |
DP83640TVV/NOPB COUNTRY OF ORIGIN
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DP83640TVV/NOPB PARAMETRIC INFO
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DP83640TVV/NOPB PACKAGE INFO
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DP83640TVV/NOPB MANUFACTURING INFO
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DP83640TVV/NOPB PACKAGING INFO
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DP83640TVV/NOPB ECAD MODELS
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DP83640TVV/NOPB APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Taiwan (Province of China)
|
Malaysia
|
|
PARAMETRIC INFO
|
| Type |
Multi-Protocol Transceiver |
| Maximum Data Rate |
100Mbps |
| Number of Channels per Chip |
1 |
| PHY Line Side Interface |
No |
| JTAG Support |
Yes |
| Standard Supported |
IEEE 1149.1|IEEE 1588|IEEE 802.3 |
| Typical Data Rate (Mbps) |
10/100 |
| Integrated CDR |
No |
| Number of Transceivers |
1 |
| Overhead Octet Support |
No |
| Maximum Power Dissipation (mW) |
290 |
| Ethernet Interface Type |
MII/RMII |
| Ethernet Speed |
10Mbps/100Mbps |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Process Technology |
CMOS |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Power Supply Type |
Analog |
| Typical Operating Supply Voltage (V) |
3.3 |
| Minimum Operating Supply Voltage (V) |
3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Operating Supply Voltage (V) |
3.3 |
| Maximum Supply Current (mA) |
105(Typ) |
|
|
PACKAGE INFO
|
| Supplier Package |
LQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
48 |
| Lead Shape |
Gull-wing |
| PCB |
48 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
7.2(Max) |
| Package Width (mm) |
7.2(Max) |
| Package Height (mm) |
1.45(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
9.2(Max) |
| Package Overall Width (mm) |
9.2(Max) |
| Package Overall Height (mm) |
1.6(Max) |
| Seated Plane Height (mm) |
1.6(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Low Profile Quad Flat Package |
| Package Family Name |
QFP |
| Jedec |
MS-026 |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging |
Tray |
| Quantity Of Packaging |
250 |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Factory Automation– Ethernet/IP– CIP Sync
|
| • Test and Measurement
– LXI Standard |
• Telecom– Basestation
|
• Real Time Networking
|
|
| |
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