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• Multiple Temperature Range from –40°C to 105°C
|
• Low-Power 3.3-V, 0.18-µm CMOS Technology
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• Low-Power Consumption < 270 mW Typical
|
| • 3.3-V MAC Interface
|
| • Auto-MDIX for 10/100 Mb/s |
| • Energy Detection Mode |
| • 25-MHz Clock Output |
| • SNI Interface (Configurable) |
| • RMII Rev. 1.2 Interface (Configurable) |
| • MII Serial Management Interface (MDC and MDIO) |
| • IEEE 802.3 MII |
| • IEEE 802.3 Auto-Negotiation and Parallel Detection |
|
| CATALOG |
| DP83848IVVX/NOPB COUNTRY OF ORIGIN |
DP83848IVVX/NOPB PARAMETRIC INFO
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DP83848IVVX/NOPB PACKAGE INFO
|
DP83848IVVX/NOPB MANUFACTURING INFO
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DP83848IVVX/NOPB PACKAGING INFO
|
DP83848IVVX/NOPB EACD MODELS
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| DP83848IVVX/NOPB APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Philippines |
| Taiwan (Province of China) |
| China |
| Malaysia |
|
PARAMETRIC INFO
|
| type |
Fast Ethernet Transceiver |
| Maximum Data Rate |
100Mbps |
| Number of Channels per Chip |
1 |
| PHY Line Side Interface |
no |
| JTAG Support |
yes |
| Standard Supported |
10BASE-T|100BASE-TX|IEEE 802.3 |
| Typical Data Rate (Mbps) |
10/100 |
| Integrated CDRs |
no |
| Number of Transceivers |
1 |
| Overhead Octet Support |
no |
| Maximum Power Dissipation (mW) |
267 |
| Ethernet Interface Type |
MII/RMII |
| Ethernet Speed |
10Mbps/100Mbps |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Rating |
Industrial |
| Process Technology |
0.18um, CMOS |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Power Supply Type |
Analog|Digital |
| Typical Operating Supply Voltage (V) |
3.3 |
| Minimum Operating Supply Voltage (V) |
3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Operating Supply Voltage (V) |
3.3 |
| Maximum Supply Current (mA) |
92(Typ) |
|
|
PACKAGE INFO
|
| Supplier packaging |
LQFP |
| Basic package type |
Lead-Frame SMT |
| Number of pins |
48 |
| Pin shape |
Gull-wing |
| PCB |
48 |
| ears |
N/R |
| Pin spacing (mm) |
0.5 |
| Package length (mm) |
7.2(Max) |
| Package width (mm) |
7.2(Max) |
| Package height (mm) |
1.45(Max) |
| Package diameter (mm) |
N/R |
| Package Overall Length (mm) |
9.2(Max) |
| Package Overall Width (mm) |
9.2(Max) |
| Package Overall Height (mm) |
1.6(Max) |
| Mounting surface height (mm) |
1.6(Max) |
| Install |
Surface Mount |
| Package weight (g) |
not applicable |
| Packaging materials |
Plastic |
| package instruction |
Low Profile Quad Flat Package |
| Package series name |
QFP |
| JEDEC |
MS-026BBC |
| Package outline |
Link to datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
30 |
| Number of reflow cycles |
3 |
| standard |
J-STD-020D |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Lead Finish(Plating) |
Matt Sn|Au |
| Plating materials |
N/A|Pd over Ni |
| Terminal Base Material |
Cu Alloy|N/A |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
X |
| Package |
Tape and reel packaging |
| Packing quantity |
1000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
16.4 |
| Tape Pitch (mm) |
12 |
| Tape Width (mm) |
16 |
| Component Orientation |
Q2 |
| packaging type file |
Link to datasheet |
|
|
ECAD MODELS
|
|
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APPLICATIONS
|
• Automotive/Transportation
|
| • General Embedded Applications |
| • Industrial Controls and Factory Automation |
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